Application of AlMgGaLi foil for joining copper to SiCp/Al-MMCs for high-temperature and high-power electronics
A novel lead-free foil (AlMgGaLi) with a melting point of 398.3 ~ 414.8 °C was developed for active soldering of copper to aluminum matrix composite. The effect of joining pressure on the microstructure, interface wetting and shear strength of the dissimilar joints was analyzed. When the joining pre...
| Main Authors: | , , , |
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| Other Authors: | |
| Format: | Journal Article |
| Language: | English |
| Published: |
2021
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| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/151487 |