Advanced 3D integration technologies in various quantum computing devices
As a key approach to augment Moore’s Law scaling, 3D integration technologies have enabled small form factor, low cost, diverse, modular and flexible assembly of integrated circuits in the semiconductor industry. It is therefore essential to adopt these technologies to the quantum computing device...
| Main Authors: | , , , , |
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| Other Authors: | |
| Format: | Journal Article |
| Language: | English |
| Published: |
2021
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| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/153118 |
| _version_ | 1811689272092131328 |
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| author | Zhao, Peng Lim, Yu Dian Li, Hong Yu Guidoni, Luca Tan, Chuan Seng |
| author2 | School of Electrical and Electronic Engineering |
| author_facet | School of Electrical and Electronic Engineering Zhao, Peng Lim, Yu Dian Li, Hong Yu Guidoni, Luca Tan, Chuan Seng |
| author_sort | Zhao, Peng |
| collection | NTU |
| description | As a key approach to augment Moore’s Law scaling, 3D integration technologies have enabled small form factor, low
cost, diverse, modular and flexible assembly of integrated circuits in the semiconductor industry. It is therefore essential to adopt
these technologies to the quantum computing devices which are at the nascent stage and generally require large scale integration
to be practical. In this review, we focus on four popular quantum bit (qubit) candidates (trapped ion, superconducting circuit,
silicon spin and photon) which are encoded by distinct physical systems but all intrinsically compatible with advanced CMOS
fabrication process. We introduce the specific scalability bottlenecks of each qubit type and present the current solutions using 3D
integration technologies. We evaluate and classify these technologies into three main categories based on the hierarchy. A brief
discussion regarding to the thermal management is also provided. We believe this review serves to provide some useful insights
on the contributions of interconnect, integration and packaging to the field of quantum computing where rapid development is
ongoing. |
| first_indexed | 2024-10-01T05:45:28Z |
| format | Journal Article |
| id | ntu-10356/153118 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2024-10-01T05:45:28Z |
| publishDate | 2021 |
| record_format | dspace |
| spelling | ntu-10356/1531182021-12-09T13:23:41Z Advanced 3D integration technologies in various quantum computing devices Zhao, Peng Lim, Yu Dian Li, Hong Yu Guidoni, Luca Tan, Chuan Seng School of Electrical and Electronic Engineering Institute of Microelectronics, A∗STAR Engineering::Electrical and electronic engineering Qubit Quantum Computing As a key approach to augment Moore’s Law scaling, 3D integration technologies have enabled small form factor, low cost, diverse, modular and flexible assembly of integrated circuits in the semiconductor industry. It is therefore essential to adopt these technologies to the quantum computing devices which are at the nascent stage and generally require large scale integration to be practical. In this review, we focus on four popular quantum bit (qubit) candidates (trapped ion, superconducting circuit, silicon spin and photon) which are encoded by distinct physical systems but all intrinsically compatible with advanced CMOS fabrication process. We introduce the specific scalability bottlenecks of each qubit type and present the current solutions using 3D integration technologies. We evaluate and classify these technologies into three main categories based on the hierarchy. A brief discussion regarding to the thermal management is also provided. We believe this review serves to provide some useful insights on the contributions of interconnect, integration and packaging to the field of quantum computing where rapid development is ongoing. Agency for Science, Technology and Research (A*STAR) National Research Foundation (NRF) Published version This work was supported by ANR-NRF Joint Grant Call (NF2020- NRF-ANR073 HIT) and A*STAR Quantum Technology for Engineering (A1685b0005). 2021-12-09T13:23:41Z 2021-12-09T13:23:41Z 2021 Journal Article Zhao, P., Lim, Y. D., Li, H. Y., Guidoni, L. & Tan, C. S. (2021). Advanced 3D integration technologies in various quantum computing devices. IEEE Open Journal of Nanotechnology, 2, 101-110. https://dx.doi.org/10.1109/OJNANO.2021.3124363 2644-1292 https://hdl.handle.net/10356/153118 10.1109/OJNANO.2021.3124363 2 101 110 en NRF2020- NRF-ANR073 HIT A1685b0005 IEEE Open Journal of Nanotechnology © 2021 The Author(s). Published by IEEE. This work is licensed under a Creative Commons Attribution 4.0 License. For more information, see https://creativecommons.org/licenses/by/4.0/ application/pdf |
| spellingShingle | Engineering::Electrical and electronic engineering Qubit Quantum Computing Zhao, Peng Lim, Yu Dian Li, Hong Yu Guidoni, Luca Tan, Chuan Seng Advanced 3D integration technologies in various quantum computing devices |
| title | Advanced 3D integration technologies in various quantum computing devices |
| title_full | Advanced 3D integration technologies in various quantum computing devices |
| title_fullStr | Advanced 3D integration technologies in various quantum computing devices |
| title_full_unstemmed | Advanced 3D integration technologies in various quantum computing devices |
| title_short | Advanced 3D integration technologies in various quantum computing devices |
| title_sort | advanced 3d integration technologies in various quantum computing devices |
| topic | Engineering::Electrical and electronic engineering Qubit Quantum Computing |
| url | https://hdl.handle.net/10356/153118 |
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