Integration of 2D materials on microscale thermistors

With the arrival of the twenty-first century, it is clear to see that people nowadays are highly dependent on computers. With the development of transistors, the size of computers keeps decreasing. However, high temperature and uneven temperature distribution become one of the major problems. The e...

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Bibliographic Details
Main Author: Wu, Yile
Other Authors: Liu Zheng
Format: Final Year Project (FYP)
Language:English
Published: Nanyang Technological University 2022
Subjects:
Online Access:https://hdl.handle.net/10356/156331
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author Wu, Yile
author2 Liu Zheng
author_facet Liu Zheng
Wu, Yile
author_sort Wu, Yile
collection NTU
description With the arrival of the twenty-first century, it is clear to see that people nowadays are highly dependent on computers. With the development of transistors, the size of computers keeps decreasing. However, high temperature and uneven temperature distribution become one of the major problems. The existing temperature sensors are either too large or not accurate enough. Recent developments regarding low dimensional materials such as CNT and graphene have drawn great attention attributed to the unique advantages of device downscaling. This report mainly focuses on the material preparation optimization of a new kind of two-dimensional (2D) composite material, AgVP2S6 (AVPS), which has been explored as a possible alternative temperature sensor. The exfoliation methods applied during sample preparation would be discussed and compared. Images taken by the optical microscope and atomic force microscope show that using Polydimethylsiloxane (PDMS) could gain high quality and micrometer-sized samples with fewer residues remaining, and a cleaner substrate. Hence, we identify using PDMS to exfoliate as the optimal method for our sample. This method will promote the process by providing a high yield of ideal samples and convenient operation.
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spelling ntu-10356/1563312022-04-17T13:49:50Z Integration of 2D materials on microscale thermistors Wu, Yile Liu Zheng School of Materials Science and Engineering Z.Liu@ntu.edu.sg Engineering::Materials With the arrival of the twenty-first century, it is clear to see that people nowadays are highly dependent on computers. With the development of transistors, the size of computers keeps decreasing. However, high temperature and uneven temperature distribution become one of the major problems. The existing temperature sensors are either too large or not accurate enough. Recent developments regarding low dimensional materials such as CNT and graphene have drawn great attention attributed to the unique advantages of device downscaling. This report mainly focuses on the material preparation optimization of a new kind of two-dimensional (2D) composite material, AgVP2S6 (AVPS), which has been explored as a possible alternative temperature sensor. The exfoliation methods applied during sample preparation would be discussed and compared. Images taken by the optical microscope and atomic force microscope show that using Polydimethylsiloxane (PDMS) could gain high quality and micrometer-sized samples with fewer residues remaining, and a cleaner substrate. Hence, we identify using PDMS to exfoliate as the optimal method for our sample. This method will promote the process by providing a high yield of ideal samples and convenient operation. Bachelor of Engineering (Materials Engineering) 2022-04-14T11:17:23Z 2022-04-14T11:17:23Z 2022 Final Year Project (FYP) Wu, Y. (2022). Integration of 2D materials on microscale thermistors. Final Year Project (FYP), Nanyang Technological University, Singapore. https://hdl.handle.net/10356/156331 https://hdl.handle.net/10356/156331 en application/pdf Nanyang Technological University
spellingShingle Engineering::Materials
Wu, Yile
Integration of 2D materials on microscale thermistors
title Integration of 2D materials on microscale thermistors
title_full Integration of 2D materials on microscale thermistors
title_fullStr Integration of 2D materials on microscale thermistors
title_full_unstemmed Integration of 2D materials on microscale thermistors
title_short Integration of 2D materials on microscale thermistors
title_sort integration of 2d materials on microscale thermistors
topic Engineering::Materials
url https://hdl.handle.net/10356/156331
work_keys_str_mv AT wuyile integrationof2dmaterialsonmicroscalethermistors