Fabrication and evaluation of Ni/WSn solder joints for die-attach technology
Micro electrical mechanical systems (MEMS) are very small integrated mechanical and electrical devices which are assembled via soldering of the individual components. For MEMS that operate at high temperatures, such solder materials are conventionally high lead content alloys, which is detrimenta...
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| Format: | Final Year Project (FYP) |
| Language: | English |
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Nanyang Technological University
2022
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| Online Access: | https://hdl.handle.net/10356/157318 |