Investigation of greener solvent for electroless nickel plating on ABS substrate
This study uses Cyrene, a bio-friendlier etching solvent than the conventional, more toxic variant, NMP, as an etching solvent for the electroless nickel plating (ENP) process on ABS substrates. The experiments conducted in this study include the solvent etching process, the ENP process using the...
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| Other Authors: | |
| Format: | Final Year Project (FYP) |
| Language: | English |
| Published: |
Nanyang Technological University
2022
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| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/158820 |
| _version_ | 1811695082856775680 |
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| author | D Selvasegaran, Rasesh |
| author2 | Hirotaka Sato |
| author_facet | Hirotaka Sato D Selvasegaran, Rasesh |
| author_sort | D Selvasegaran, Rasesh |
| collection | NTU |
| description | This study uses Cyrene, a bio-friendlier etching solvent than the conventional, more toxic
variant, NMP, as an etching solvent for the electroless nickel plating (ENP) process on ABS
substrates. The experiments conducted in this study include the solvent etching process, the ENP
process using the PEI conditioner, and the conventional ENP process.
The basic design of this study was to compare the ENP characteristics using two sets of samples,
one for NMP and one for Cyrene as its etching solvent. The significant factors that were used to
analyze the effectiveness of the solvents were the ENP characteristics, conductivity, and peel
adhesion test results of the substrate.
Using Cyrene and NMP, an indication of the successful etching and nickel plating was done by
measuring the resistance of the plated surface using a conductivity probe tester. A simplified
Peel Adhesion Tape Test was also used to characterize the peel adhesion strength of the plating
on the substrates after the ENP process.
Analysis of the results found that Cyrene is a potent substitute for NMP as an etching solvent.
Substrates etched with Cyrene performed similarly in plating pattern and area. Cyrene displayed
a 12% reduction of the area removed from the Peel Adhesion Test compared to NMP, thus
concluding that Cyrene is an excellent bio-friendlier substitute to NMP as an etching solvent. |
| first_indexed | 2024-10-01T07:17:49Z |
| format | Final Year Project (FYP) |
| id | ntu-10356/158820 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2024-10-01T07:17:49Z |
| publishDate | 2022 |
| publisher | Nanyang Technological University |
| record_format | dspace |
| spelling | ntu-10356/1588202022-06-07T06:03:16Z Investigation of greener solvent for electroless nickel plating on ABS substrate D Selvasegaran, Rasesh Hirotaka Sato School of Mechanical and Aerospace Engineering hirosato@ntu.edu.sg Engineering::Mechanical engineering This study uses Cyrene, a bio-friendlier etching solvent than the conventional, more toxic variant, NMP, as an etching solvent for the electroless nickel plating (ENP) process on ABS substrates. The experiments conducted in this study include the solvent etching process, the ENP process using the PEI conditioner, and the conventional ENP process. The basic design of this study was to compare the ENP characteristics using two sets of samples, one for NMP and one for Cyrene as its etching solvent. The significant factors that were used to analyze the effectiveness of the solvents were the ENP characteristics, conductivity, and peel adhesion test results of the substrate. Using Cyrene and NMP, an indication of the successful etching and nickel plating was done by measuring the resistance of the plated surface using a conductivity probe tester. A simplified Peel Adhesion Tape Test was also used to characterize the peel adhesion strength of the plating on the substrates after the ENP process. Analysis of the results found that Cyrene is a potent substitute for NMP as an etching solvent. Substrates etched with Cyrene performed similarly in plating pattern and area. Cyrene displayed a 12% reduction of the area removed from the Peel Adhesion Test compared to NMP, thus concluding that Cyrene is an excellent bio-friendlier substitute to NMP as an etching solvent. Bachelor of Engineering (Mechanical Engineering) 2022-06-07T06:03:16Z 2022-06-07T06:03:16Z 2022 Final Year Project (FYP) D Selvasegaran, R. (2022). Investigation of greener solvent for electroless nickel plating on ABS substrate. Final Year Project (FYP), Nanyang Technological University, Singapore. https://hdl.handle.net/10356/158820 https://hdl.handle.net/10356/158820 en B398 application/pdf Nanyang Technological University |
| spellingShingle | Engineering::Mechanical engineering D Selvasegaran, Rasesh Investigation of greener solvent for electroless nickel plating on ABS substrate |
| title | Investigation of greener solvent for electroless nickel plating on ABS substrate |
| title_full | Investigation of greener solvent for electroless nickel plating on ABS substrate |
| title_fullStr | Investigation of greener solvent for electroless nickel plating on ABS substrate |
| title_full_unstemmed | Investigation of greener solvent for electroless nickel plating on ABS substrate |
| title_short | Investigation of greener solvent for electroless nickel plating on ABS substrate |
| title_sort | investigation of greener solvent for electroless nickel plating on abs substrate |
| topic | Engineering::Mechanical engineering |
| url | https://hdl.handle.net/10356/158820 |
| work_keys_str_mv | AT dselvasegaranrasesh investigationofgreenersolventforelectrolessnickelplatingonabssubstrate |