Atomistic simulations of the mechanical properties of thin film materials
Molecular Dynamics (MD) simulation is a modern and effective tool to study the mechanical properties of micro- and nano- scale materials such as thin films, which may exhibit different behavior compared to bulk material. As such, MD simulation was used to atomistically study the mechanical propertie...
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Format: | Final Year Project (FYP) |
Language: | English |
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Nanyang Technological University
2022
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Online Access: | https://hdl.handle.net/10356/159205 |
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author | Say, Evan Jun Jie |
author2 | Lai Changquan |
author_facet | Lai Changquan Say, Evan Jun Jie |
author_sort | Say, Evan Jun Jie |
collection | NTU |
description | Molecular Dynamics (MD) simulation is a modern and effective tool to study the mechanical properties of micro- and nano- scale materials such as thin films, which may exhibit different behavior compared to bulk material. As such, MD simulation was used to atomistically study the mechanical properties of copper thin films under uniaxial tension, increasing the film’s length along the direction of strain, strain rate and externally applied heat in order to find the thickness where a bulk material begins exhibiting thin film properties or vice versa. It was found that applying a sudden and very high strain rate has the biggest effect on yield strength and elastic modulus, causing the copper thin film to exhibit a drastic increase in yield strength. As such, expected strain rate should be used as a primary design constraint over thickness in order to save material cost. |
first_indexed | 2024-10-01T06:02:02Z |
format | Final Year Project (FYP) |
id | ntu-10356/159205 |
institution | Nanyang Technological University |
language | English |
last_indexed | 2024-10-01T06:02:02Z |
publishDate | 2022 |
publisher | Nanyang Technological University |
record_format | dspace |
spelling | ntu-10356/1592052023-03-04T20:10:51Z Atomistic simulations of the mechanical properties of thin film materials Say, Evan Jun Jie Lai Changquan School of Mechanical and Aerospace Engineering cqlai@ntu.edu.sg Engineering::Materials::Nanostructured materials Engineering::Mechanical engineering::Mechanics and dynamics Molecular Dynamics (MD) simulation is a modern and effective tool to study the mechanical properties of micro- and nano- scale materials such as thin films, which may exhibit different behavior compared to bulk material. As such, MD simulation was used to atomistically study the mechanical properties of copper thin films under uniaxial tension, increasing the film’s length along the direction of strain, strain rate and externally applied heat in order to find the thickness where a bulk material begins exhibiting thin film properties or vice versa. It was found that applying a sudden and very high strain rate has the biggest effect on yield strength and elastic modulus, causing the copper thin film to exhibit a drastic increase in yield strength. As such, expected strain rate should be used as a primary design constraint over thickness in order to save material cost. Bachelor of Engineering (Mechanical Engineering) 2022-06-14T06:11:09Z 2022-06-14T06:11:09Z 2022 Final Year Project (FYP) Say, E. J. J. (2022). Atomistic simulations of the mechanical properties of thin film materials. Final Year Project (FYP), Nanyang Technological University, Singapore. https://hdl.handle.net/10356/159205 https://hdl.handle.net/10356/159205 en B319 application/pdf Nanyang Technological University |
spellingShingle | Engineering::Materials::Nanostructured materials Engineering::Mechanical engineering::Mechanics and dynamics Say, Evan Jun Jie Atomistic simulations of the mechanical properties of thin film materials |
title | Atomistic simulations of the mechanical properties of thin film materials |
title_full | Atomistic simulations of the mechanical properties of thin film materials |
title_fullStr | Atomistic simulations of the mechanical properties of thin film materials |
title_full_unstemmed | Atomistic simulations of the mechanical properties of thin film materials |
title_short | Atomistic simulations of the mechanical properties of thin film materials |
title_sort | atomistic simulations of the mechanical properties of thin film materials |
topic | Engineering::Materials::Nanostructured materials Engineering::Mechanical engineering::Mechanics and dynamics |
url | https://hdl.handle.net/10356/159205 |
work_keys_str_mv | AT sayevanjunjie atomisticsimulationsofthemechanicalpropertiesofthinfilmmaterials |