Atomistic simulations of the mechanical properties of thin film materials

Molecular Dynamics (MD) simulation is a modern and effective tool to study the mechanical properties of micro- and nano- scale materials such as thin films, which may exhibit different behavior compared to bulk material. As such, MD simulation was used to atomistically study the mechanical propertie...

Full description

Bibliographic Details
Main Author: Say, Evan Jun Jie
Other Authors: Lai Changquan
Format: Final Year Project (FYP)
Language:English
Published: Nanyang Technological University 2022
Subjects:
Online Access:https://hdl.handle.net/10356/159205
_version_ 1826123277496483840
author Say, Evan Jun Jie
author2 Lai Changquan
author_facet Lai Changquan
Say, Evan Jun Jie
author_sort Say, Evan Jun Jie
collection NTU
description Molecular Dynamics (MD) simulation is a modern and effective tool to study the mechanical properties of micro- and nano- scale materials such as thin films, which may exhibit different behavior compared to bulk material. As such, MD simulation was used to atomistically study the mechanical properties of copper thin films under uniaxial tension, increasing the film’s length along the direction of strain, strain rate and externally applied heat in order to find the thickness where a bulk material begins exhibiting thin film properties or vice versa. It was found that applying a sudden and very high strain rate has the biggest effect on yield strength and elastic modulus, causing the copper thin film to exhibit a drastic increase in yield strength. As such, expected strain rate should be used as a primary design constraint over thickness in order to save material cost.
first_indexed 2024-10-01T06:02:02Z
format Final Year Project (FYP)
id ntu-10356/159205
institution Nanyang Technological University
language English
last_indexed 2024-10-01T06:02:02Z
publishDate 2022
publisher Nanyang Technological University
record_format dspace
spelling ntu-10356/1592052023-03-04T20:10:51Z Atomistic simulations of the mechanical properties of thin film materials Say, Evan Jun Jie Lai Changquan School of Mechanical and Aerospace Engineering cqlai@ntu.edu.sg Engineering::Materials::Nanostructured materials Engineering::Mechanical engineering::Mechanics and dynamics Molecular Dynamics (MD) simulation is a modern and effective tool to study the mechanical properties of micro- and nano- scale materials such as thin films, which may exhibit different behavior compared to bulk material. As such, MD simulation was used to atomistically study the mechanical properties of copper thin films under uniaxial tension, increasing the film’s length along the direction of strain, strain rate and externally applied heat in order to find the thickness where a bulk material begins exhibiting thin film properties or vice versa. It was found that applying a sudden and very high strain rate has the biggest effect on yield strength and elastic modulus, causing the copper thin film to exhibit a drastic increase in yield strength. As such, expected strain rate should be used as a primary design constraint over thickness in order to save material cost. Bachelor of Engineering (Mechanical Engineering) 2022-06-14T06:11:09Z 2022-06-14T06:11:09Z 2022 Final Year Project (FYP) Say, E. J. J. (2022). Atomistic simulations of the mechanical properties of thin film materials. Final Year Project (FYP), Nanyang Technological University, Singapore. https://hdl.handle.net/10356/159205 https://hdl.handle.net/10356/159205 en B319 application/pdf Nanyang Technological University
spellingShingle Engineering::Materials::Nanostructured materials
Engineering::Mechanical engineering::Mechanics and dynamics
Say, Evan Jun Jie
Atomistic simulations of the mechanical properties of thin film materials
title Atomistic simulations of the mechanical properties of thin film materials
title_full Atomistic simulations of the mechanical properties of thin film materials
title_fullStr Atomistic simulations of the mechanical properties of thin film materials
title_full_unstemmed Atomistic simulations of the mechanical properties of thin film materials
title_short Atomistic simulations of the mechanical properties of thin film materials
title_sort atomistic simulations of the mechanical properties of thin film materials
topic Engineering::Materials::Nanostructured materials
Engineering::Mechanical engineering::Mechanics and dynamics
url https://hdl.handle.net/10356/159205
work_keys_str_mv AT sayevanjunjie atomisticsimulationsofthemechanicalpropertiesofthinfilmmaterials