Direct laser writing of graphene-based electrical interconnects for printed circuit board repair

Malfunctions in printed circuit boards (PCBs) are often caused by damaged copper traces. Printing materials such as metal nanoparticles, conductive polymers, and graphene along with novel printing methods are being actively explored for repairing the conductive connections in PCBs. Because of its hi...

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Main Authors: Lim, Joel Chin Huat, Suchand Sandeep, Chandramathi Sukumaran, Murukeshan, Vadakke Matham, Kim, Young-Jin
Other Authors: School of Mechanical and Aerospace Engineering
Format: Journal Article
Language:English
Published: 2022
Subjects:
Online Access:https://hdl.handle.net/10356/159582
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author Lim, Joel Chin Huat
Suchand Sandeep, Chandramathi Sukumaran
Murukeshan, Vadakke Matham
Kim, Young-Jin
author2 School of Mechanical and Aerospace Engineering
author_facet School of Mechanical and Aerospace Engineering
Lim, Joel Chin Huat
Suchand Sandeep, Chandramathi Sukumaran
Murukeshan, Vadakke Matham
Kim, Young-Jin
author_sort Lim, Joel Chin Huat
collection NTU
description Malfunctions in printed circuit boards (PCBs) are often caused by damaged copper traces. Printing materials such as metal nanoparticles, conductive polymers, and graphene along with novel printing methods are being actively explored for repairing the conductive connections in PCBs. Because of its high-resolution capability, direct writing of conductive traces gets significant attention, especially with the widespread use of flexible PCBs. Graphene is an ideal material for such applications due to its excellent electrical and mechanical properties. However, there have been limited reports on graphene-based methods for the facile fabrication of conductive traces. A novel method of femtosecond laser direct writing of graphene traces by the photoreduction of graphene oxide (GO) to conductive reduced GO (rGO) for repair and modification of legacy PCBs is reported. A trace-width resolution of 28.4 μm is achieved over a large patterning area of 100 mm × 100 mm. The rGO thickness is found to be tunable from 0.6 to 4.4 μm, while the sheet resistance is minimized to 100 Ω sq−1. The system capability is demonstrated by printing conductive traces on top of a flexible substrate to form a closed path for turning on a light-emitting diode, as well as, by repairing a commercial PCB.
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spelling ntu-10356/1595822022-06-28T01:13:18Z Direct laser writing of graphene-based electrical interconnects for printed circuit board repair Lim, Joel Chin Huat Suchand Sandeep, Chandramathi Sukumaran Murukeshan, Vadakke Matham Kim, Young-Jin School of Mechanical and Aerospace Engineering Singapore Centre for 3D Printing Centre for Optical and Laser Engineering Engineering::Mechanical engineering Femtosecond Laser Direct Writing Flexible Electronics Malfunctions in printed circuit boards (PCBs) are often caused by damaged copper traces. Printing materials such as metal nanoparticles, conductive polymers, and graphene along with novel printing methods are being actively explored for repairing the conductive connections in PCBs. Because of its high-resolution capability, direct writing of conductive traces gets significant attention, especially with the widespread use of flexible PCBs. Graphene is an ideal material for such applications due to its excellent electrical and mechanical properties. However, there have been limited reports on graphene-based methods for the facile fabrication of conductive traces. A novel method of femtosecond laser direct writing of graphene traces by the photoreduction of graphene oxide (GO) to conductive reduced GO (rGO) for repair and modification of legacy PCBs is reported. A trace-width resolution of 28.4 μm is achieved over a large patterning area of 100 mm × 100 mm. The rGO thickness is found to be tunable from 0.6 to 4.4 μm, while the sheet resistance is minimized to 100 Ω sq−1. The system capability is demonstrated by printing conductive traces on top of a flexible substrate to form a closed path for turning on a light-emitting diode, as well as, by repairing a commercial PCB. The authors acknowledge funding received from research collaboration agreement by Panasonic Factory Solutions Asia Pacific (PFSAP) and Singapore Centre for 3D Printing (RCA-15/027). Y.-J.K. acknowledges funding from National Research Foundation of the Republic of Korea (NRF-2012R1A3A1050386, NRF-2020R1A2C2102338, NRF2021R1A4A1031660), Korea Forest Service (Korea Forestry Promotion Institute) through the R&D Program for Forest Science Technology (2020229C10-2022-AC01), KAIST UP Program, and Basic Research Program (NK224C) funded by the Korea Institute of Machinery and Materials. 2022-06-28T01:13:18Z 2022-06-28T01:13:18Z 2021 Journal Article Lim, J. C. H., Suchand Sandeep, C. S., Murukeshan, V. M. & Kim, Y. (2021). Direct laser writing of graphene-based electrical interconnects for printed circuit board repair. Advanced Materials Technologies, 6(12), 2100514-. https://dx.doi.org/10.1002/admt.202100514 2365-709X https://hdl.handle.net/10356/159582 10.1002/admt.202100514 2-s2.0-85113158573 12 6 2100514 en RCA-15/027 Advanced Materials Technologies © 2021 Wiley-VCH GmbH. All rights reserved.
spellingShingle Engineering::Mechanical engineering
Femtosecond Laser Direct Writing
Flexible Electronics
Lim, Joel Chin Huat
Suchand Sandeep, Chandramathi Sukumaran
Murukeshan, Vadakke Matham
Kim, Young-Jin
Direct laser writing of graphene-based electrical interconnects for printed circuit board repair
title Direct laser writing of graphene-based electrical interconnects for printed circuit board repair
title_full Direct laser writing of graphene-based electrical interconnects for printed circuit board repair
title_fullStr Direct laser writing of graphene-based electrical interconnects for printed circuit board repair
title_full_unstemmed Direct laser writing of graphene-based electrical interconnects for printed circuit board repair
title_short Direct laser writing of graphene-based electrical interconnects for printed circuit board repair
title_sort direct laser writing of graphene based electrical interconnects for printed circuit board repair
topic Engineering::Mechanical engineering
Femtosecond Laser Direct Writing
Flexible Electronics
url https://hdl.handle.net/10356/159582
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