Power consumption and thermal performance of integrated spray and jet array cooling vapor chambers
An integrated arrayed spray impingement vapor chamber (ISVC) is designed for cooling high-power electronic devices. The spray array is arranged on the vapor chamber to measure thermal performance in comparison with the other two integrated arrayed jet impingement vapor chambers (IJVCs) with differen...
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Format: | Journal Article |
Language: | English |
Published: |
2022
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Online Access: | https://hdl.handle.net/10356/163358 |
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author | Yi, Li Chen, Chaomeng Duan, Fei Pan, Minqiang |
author2 | School of Mechanical and Aerospace Engineering |
author_facet | School of Mechanical and Aerospace Engineering Yi, Li Chen, Chaomeng Duan, Fei Pan, Minqiang |
author_sort | Yi, Li |
collection | NTU |
description | An integrated arrayed spray impingement vapor chamber (ISVC) is designed for cooling high-power electronic devices. The spray array is arranged on the vapor chamber to measure thermal performance in comparison with the other two integrated arrayed jet impingement vapor chambers (IJVCs) with different jet orifice diameters, named IJVC-0.8 and IJVC-3.0, on the basis of the inlet and outlet diameters of the spray nozzles. Tests have been conducted on pressure drop, power consumption, heat dissipation performance, temperature uniformity, and comprehensive performance. Results show that the pressure drop and power consumption of IJVC-0.8 and IJVC-3.0 are 1.36–1.53 and 0.079–0.09 times those of ISVC. In addition, the heat dissipation performance and temperature uniformity of the ISVC are better than those of IJVCs for given tests conditions. Furthermore, the heat dissipation of ISVC shows more advantage than those of IJVCs as the power is increased. Finally, the comprehensive performance of ISVC is revealed to be superior to that of IJVC if the exit apertures of the spray nozzles and jet holes are equal in diameter. In the IJVCs, choosing larger jet holes is to sacrifice part of the heat dissipation capacity, but compensate for the detrimental effects of high pressure drop, and subsequently improve its overall performance. |
first_indexed | 2024-10-01T05:00:50Z |
format | Journal Article |
id | ntu-10356/163358 |
institution | Nanyang Technological University |
language | English |
last_indexed | 2024-10-01T05:00:50Z |
publishDate | 2022 |
record_format | dspace |
spelling | ntu-10356/1633582022-12-05T02:09:20Z Power consumption and thermal performance of integrated spray and jet array cooling vapor chambers Yi, Li Chen, Chaomeng Duan, Fei Pan, Minqiang School of Mechanical and Aerospace Engineering Engineering::Mechanical engineering Spray Cooling Jet Impingement An integrated arrayed spray impingement vapor chamber (ISVC) is designed for cooling high-power electronic devices. The spray array is arranged on the vapor chamber to measure thermal performance in comparison with the other two integrated arrayed jet impingement vapor chambers (IJVCs) with different jet orifice diameters, named IJVC-0.8 and IJVC-3.0, on the basis of the inlet and outlet diameters of the spray nozzles. Tests have been conducted on pressure drop, power consumption, heat dissipation performance, temperature uniformity, and comprehensive performance. Results show that the pressure drop and power consumption of IJVC-0.8 and IJVC-3.0 are 1.36–1.53 and 0.079–0.09 times those of ISVC. In addition, the heat dissipation performance and temperature uniformity of the ISVC are better than those of IJVCs for given tests conditions. Furthermore, the heat dissipation of ISVC shows more advantage than those of IJVCs as the power is increased. Finally, the comprehensive performance of ISVC is revealed to be superior to that of IJVC if the exit apertures of the spray nozzles and jet holes are equal in diameter. In the IJVCs, choosing larger jet holes is to sacrifice part of the heat dissipation capacity, but compensate for the detrimental effects of high pressure drop, and subsequently improve its overall performance. This research was supported by National Natural Science Foundation of Guangdong, China, No. 2022A1515011911.The authors thank for the financial support from the program of the China Scholarships Council (CSC No. 202106150067). 2022-12-05T02:09:20Z 2022-12-05T02:09:20Z 2023 Journal Article Yi, L., Chen, C., Duan, F. & Pan, M. (2023). Power consumption and thermal performance of integrated spray and jet array cooling vapor chambers. Applied Thermal Engineering, 218, 119266-. https://dx.doi.org/10.1016/j.applthermaleng.2022.119266 1359-4311 https://hdl.handle.net/10356/163358 10.1016/j.applthermaleng.2022.119266 2-s2.0-85138066711 218 119266 en Applied Thermal Engineering © 2022 Elsevier Ltd. All rights reserved. |
spellingShingle | Engineering::Mechanical engineering Spray Cooling Jet Impingement Yi, Li Chen, Chaomeng Duan, Fei Pan, Minqiang Power consumption and thermal performance of integrated spray and jet array cooling vapor chambers |
title | Power consumption and thermal performance of integrated spray and jet array cooling vapor chambers |
title_full | Power consumption and thermal performance of integrated spray and jet array cooling vapor chambers |
title_fullStr | Power consumption and thermal performance of integrated spray and jet array cooling vapor chambers |
title_full_unstemmed | Power consumption and thermal performance of integrated spray and jet array cooling vapor chambers |
title_short | Power consumption and thermal performance of integrated spray and jet array cooling vapor chambers |
title_sort | power consumption and thermal performance of integrated spray and jet array cooling vapor chambers |
topic | Engineering::Mechanical engineering Spray Cooling Jet Impingement |
url | https://hdl.handle.net/10356/163358 |
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