Power consumption and thermal performance of integrated spray and jet array cooling vapor chambers

An integrated arrayed spray impingement vapor chamber (ISVC) is designed for cooling high-power electronic devices. The spray array is arranged on the vapor chamber to measure thermal performance in comparison with the other two integrated arrayed jet impingement vapor chambers (IJVCs) with differen...

Full description

Bibliographic Details
Main Authors: Yi, Li, Chen, Chaomeng, Duan, Fei, Pan, Minqiang
Other Authors: School of Mechanical and Aerospace Engineering
Format: Journal Article
Language:English
Published: 2022
Subjects:
Online Access:https://hdl.handle.net/10356/163358
_version_ 1826119488823623680
author Yi, Li
Chen, Chaomeng
Duan, Fei
Pan, Minqiang
author2 School of Mechanical and Aerospace Engineering
author_facet School of Mechanical and Aerospace Engineering
Yi, Li
Chen, Chaomeng
Duan, Fei
Pan, Minqiang
author_sort Yi, Li
collection NTU
description An integrated arrayed spray impingement vapor chamber (ISVC) is designed for cooling high-power electronic devices. The spray array is arranged on the vapor chamber to measure thermal performance in comparison with the other two integrated arrayed jet impingement vapor chambers (IJVCs) with different jet orifice diameters, named IJVC-0.8 and IJVC-3.0, on the basis of the inlet and outlet diameters of the spray nozzles. Tests have been conducted on pressure drop, power consumption, heat dissipation performance, temperature uniformity, and comprehensive performance. Results show that the pressure drop and power consumption of IJVC-0.8 and IJVC-3.0 are 1.36–1.53 and 0.079–0.09 times those of ISVC. In addition, the heat dissipation performance and temperature uniformity of the ISVC are better than those of IJVCs for given tests conditions. Furthermore, the heat dissipation of ISVC shows more advantage than those of IJVCs as the power is increased. Finally, the comprehensive performance of ISVC is revealed to be superior to that of IJVC if the exit apertures of the spray nozzles and jet holes are equal in diameter. In the IJVCs, choosing larger jet holes is to sacrifice part of the heat dissipation capacity, but compensate for the detrimental effects of high pressure drop, and subsequently improve its overall performance.
first_indexed 2024-10-01T05:00:50Z
format Journal Article
id ntu-10356/163358
institution Nanyang Technological University
language English
last_indexed 2024-10-01T05:00:50Z
publishDate 2022
record_format dspace
spelling ntu-10356/1633582022-12-05T02:09:20Z Power consumption and thermal performance of integrated spray and jet array cooling vapor chambers Yi, Li Chen, Chaomeng Duan, Fei Pan, Minqiang School of Mechanical and Aerospace Engineering Engineering::Mechanical engineering Spray Cooling Jet Impingement An integrated arrayed spray impingement vapor chamber (ISVC) is designed for cooling high-power electronic devices. The spray array is arranged on the vapor chamber to measure thermal performance in comparison with the other two integrated arrayed jet impingement vapor chambers (IJVCs) with different jet orifice diameters, named IJVC-0.8 and IJVC-3.0, on the basis of the inlet and outlet diameters of the spray nozzles. Tests have been conducted on pressure drop, power consumption, heat dissipation performance, temperature uniformity, and comprehensive performance. Results show that the pressure drop and power consumption of IJVC-0.8 and IJVC-3.0 are 1.36–1.53 and 0.079–0.09 times those of ISVC. In addition, the heat dissipation performance and temperature uniformity of the ISVC are better than those of IJVCs for given tests conditions. Furthermore, the heat dissipation of ISVC shows more advantage than those of IJVCs as the power is increased. Finally, the comprehensive performance of ISVC is revealed to be superior to that of IJVC if the exit apertures of the spray nozzles and jet holes are equal in diameter. In the IJVCs, choosing larger jet holes is to sacrifice part of the heat dissipation capacity, but compensate for the detrimental effects of high pressure drop, and subsequently improve its overall performance. This research was supported by National Natural Science Foundation of Guangdong, China, No. 2022A1515011911.The authors thank for the financial support from the program of the China Scholarships Council (CSC No. 202106150067). 2022-12-05T02:09:20Z 2022-12-05T02:09:20Z 2023 Journal Article Yi, L., Chen, C., Duan, F. & Pan, M. (2023). Power consumption and thermal performance of integrated spray and jet array cooling vapor chambers. Applied Thermal Engineering, 218, 119266-. https://dx.doi.org/10.1016/j.applthermaleng.2022.119266 1359-4311 https://hdl.handle.net/10356/163358 10.1016/j.applthermaleng.2022.119266 2-s2.0-85138066711 218 119266 en Applied Thermal Engineering © 2022 Elsevier Ltd. All rights reserved.
spellingShingle Engineering::Mechanical engineering
Spray Cooling
Jet Impingement
Yi, Li
Chen, Chaomeng
Duan, Fei
Pan, Minqiang
Power consumption and thermal performance of integrated spray and jet array cooling vapor chambers
title Power consumption and thermal performance of integrated spray and jet array cooling vapor chambers
title_full Power consumption and thermal performance of integrated spray and jet array cooling vapor chambers
title_fullStr Power consumption and thermal performance of integrated spray and jet array cooling vapor chambers
title_full_unstemmed Power consumption and thermal performance of integrated spray and jet array cooling vapor chambers
title_short Power consumption and thermal performance of integrated spray and jet array cooling vapor chambers
title_sort power consumption and thermal performance of integrated spray and jet array cooling vapor chambers
topic Engineering::Mechanical engineering
Spray Cooling
Jet Impingement
url https://hdl.handle.net/10356/163358
work_keys_str_mv AT yili powerconsumptionandthermalperformanceofintegratedsprayandjetarraycoolingvaporchambers
AT chenchaomeng powerconsumptionandthermalperformanceofintegratedsprayandjetarraycoolingvaporchambers
AT duanfei powerconsumptionandthermalperformanceofintegratedsprayandjetarraycoolingvaporchambers
AT panminqiang powerconsumptionandthermalperformanceofintegratedsprayandjetarraycoolingvaporchambers