Some thermal mismatch problems in electronic devices
Electronic devices consist of multiple layers of different materials having different coefficient of thermal expansion (CTE). During processing, the high operating temperature induces thermal stress on the interface of the different layer as well as thermally-induced bending of the structure due to...
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| Formato: | Final Year Project (FYP) |
| Lenguaje: | English |
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2009
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| Acceso en línea: | http://hdl.handle.net/10356/16614 |