The integration of grounding plane into tsv integrated ion trap for efficient thermal management in large scale quantum computing device

The integration of grounding plane into tsv integrated ion trap for efficient thermal management in large scale quantum computing device

In this work, we demonstrate the addition of grounding plane into the through silicon via (TSV) integrated ion trap to minimize the ion trap heating by effectively shielding the lossy silicon substrate from RF penetration. Windows are made onto this grounding plane to allow the passing through of th...

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Bibliographic Details
Main Authors: Zhao, Peng, Li, Hong Yu, Lim, Yu Dian, Seit, Wen Wei, Guidoni, Luca, Tan, Chuan Seng
Other Authors: School of Electrical and Electronic Engineering
Format: Conference Paper
Language:English
Published: 2023
Subjects:
Engineering::Electrical and electronic engineering::Electronic packaging
Grounding Plane
Heterogenous Integration
Online Access:https://hdl.handle.net/10356/166181

Internet

https://hdl.handle.net/10356/166181

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