| Summary: | The introduction of wire embedding into Additive Manufacturing processes develops the
potential to integrate electrical functions into the component. The use of copper wire in 3D
printing applications has gained significant interest due to its material properties such as high
thermal and electrical conductivity. However, the extrusion and embedding of wire in a 3D
printing process requires careful consideration due to the heat transfer process involved.
This paper aims to perform a comprehensive heat transfer analysis of the copper wire extrusion
and embedding process and will involve a detailed analysis of the temperature distribution in
the wire, substrate and printing environment during the process. In order to develop on the
current extrusion and embedding process, the printing parameters will be altered and tested to
analyse and study the difference in heat transfer analysis outcome. The results of this analysis
will provide insights into the heat transfer mechanisms involved and will help in the
optimization of the process parameters in order to achieve high-quality prints with minimal
defects. The key findings from this study were that the current dwell time could be shortened,
wire extrusion length and nozzle temperature could be increased. The improved parameters
will help optimize the copper wire laying and embedding process.
This study will also contribute to the broader understanding of heat transfer in additive
manufacturing processes. This will prove to be essential for the development of a more efficient
and reliable 3D printing technology.
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