Heat transfer analysis of copper wire extrusion and embedding process via filament extrusion technique for 3D printing applications
The introduction of wire embedding into Additive Manufacturing processes develops the potential to integrate electrical functions into the component. The use of copper wire in 3D printing applications has gained significant interest due to its material properties such as high thermal and elect...
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| Formato: | Final Year Project (FYP) |
| Idioma: | English |
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Nanyang Technological University
2023
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| Acesso em linha: | https://hdl.handle.net/10356/168282 |