Effects of residual stresses on the stiffness of MEMS structures
In inertial sensor applications a thermocompression bond is often used for die attachment in hermetic, vacuum packages. These bonds are made by heating the ceramic chip carrier and the MEMS sensor die to ~325°C, bonding the components, and cooling to ambient conditions. Due to mismatch in thermal ex...
Main Author: | See, Sau Fong. |
---|---|
Other Authors: | Ong Lin Seng |
Format: | Final Year Project (FYP) |
Language: | English |
Published: |
2009
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Subjects: | |
Online Access: | http://hdl.handle.net/10356/16854 |
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