Film boiling suppression and boiling heat transfer enhancement by dielectrophoretic effect
Two-phase heat transfer is one of the most efficient methods for heat dissipation for heated surfaces. However, there is an operational limit called film boiling for any heated surface whereby high surface temperature generates sufficient vapor to form a steady vapor film that both covers the heated...
| Main Authors: | , , , , |
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| Other Authors: | |
| Format: | Journal Article |
| Language: | English |
| Published: |
2023
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| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/168917 |
| _version_ | 1826111556543315968 |
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| author | Nguyen, Thien-Binh Vo, Quoc Shang, X. Buang, F. Tran, Tuan |
| author2 | School of Mechanical and Aerospace Engineering |
| author_facet | School of Mechanical and Aerospace Engineering Nguyen, Thien-Binh Vo, Quoc Shang, X. Buang, F. Tran, Tuan |
| author_sort | Nguyen, Thien-Binh |
| collection | NTU |
| description | Two-phase heat transfer is one of the most efficient methods for heat dissipation for heated surfaces. However, there is an operational limit called film boiling for any heated surface whereby high surface temperature generates sufficient vapor to form a steady vapor film that both covers the heated surface and drastically reduces the heat dissipation rate. In this study, we introduce a novel approach using the dielectrophoretic effect to suppress the film boiling behavior and enhance the heat transfer rate. We experimentally characterize the transition from film boiling to nucleate boiling caused by the dielectrophoretic effect. We also experimentally determine the dependence of heat transfer enhancement and the associated surface temperature decrease on the applied voltage used to induce the dielectrophoretic effect. We demonstrate that for a smooth surface, activating the dielectrophoretic effect leads to an enhancement in critical heat flux up to 200% within our explored range of applied voltage. |
| first_indexed | 2024-10-01T02:52:41Z |
| format | Journal Article |
| id | ntu-10356/168917 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2024-10-01T02:52:41Z |
| publishDate | 2023 |
| record_format | dspace |
| spelling | ntu-10356/1689172023-06-22T06:00:05Z Film boiling suppression and boiling heat transfer enhancement by dielectrophoretic effect Nguyen, Thien-Binh Vo, Quoc Shang, X. Buang, F. Tran, Tuan School of Mechanical and Aerospace Engineering Engineering::Mechanical engineering Film Boiling Nucleate Boiling Two-phase heat transfer is one of the most efficient methods for heat dissipation for heated surfaces. However, there is an operational limit called film boiling for any heated surface whereby high surface temperature generates sufficient vapor to form a steady vapor film that both covers the heated surface and drastically reduces the heat dissipation rate. In this study, we introduce a novel approach using the dielectrophoretic effect to suppress the film boiling behavior and enhance the heat transfer rate. We experimentally characterize the transition from film boiling to nucleate boiling caused by the dielectrophoretic effect. We also experimentally determine the dependence of heat transfer enhancement and the associated surface temperature decrease on the applied voltage used to induce the dielectrophoretic effect. We demonstrate that for a smooth surface, activating the dielectrophoretic effect leads to an enhancement in critical heat flux up to 200% within our explored range of applied voltage. Ministry of Education (MOE) This work was supported by Nanyang Technological University (NTU) and the Ministry of Education (MOE, grant number MOE2018-T2- 2-113), Singapore. 2023-06-22T06:00:05Z 2023-06-22T06:00:05Z 2023 Journal Article Nguyen, T., Vo, Q., Shang, X., Buang, F. & Tran, T. (2023). Film boiling suppression and boiling heat transfer enhancement by dielectrophoretic effect. Thermal Science and Engineering Progress, 40, 101796-. https://dx.doi.org/10.1016/j.tsep.2023.101796 2451-9049 https://hdl.handle.net/10356/168917 10.1016/j.tsep.2023.101796 2-s2.0-85151056431 40 101796 en MOE2018-T2- 2-113 Thermal Science and Engineering Progress © 2023 Elsevier Ltd. All rights reserved. |
| spellingShingle | Engineering::Mechanical engineering Film Boiling Nucleate Boiling Nguyen, Thien-Binh Vo, Quoc Shang, X. Buang, F. Tran, Tuan Film boiling suppression and boiling heat transfer enhancement by dielectrophoretic effect |
| title | Film boiling suppression and boiling heat transfer enhancement by dielectrophoretic effect |
| title_full | Film boiling suppression and boiling heat transfer enhancement by dielectrophoretic effect |
| title_fullStr | Film boiling suppression and boiling heat transfer enhancement by dielectrophoretic effect |
| title_full_unstemmed | Film boiling suppression and boiling heat transfer enhancement by dielectrophoretic effect |
| title_short | Film boiling suppression and boiling heat transfer enhancement by dielectrophoretic effect |
| title_sort | film boiling suppression and boiling heat transfer enhancement by dielectrophoretic effect |
| topic | Engineering::Mechanical engineering Film Boiling Nucleate Boiling |
| url | https://hdl.handle.net/10356/168917 |
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