Hydrogels for flexible electronics
Hydrogels have emerged as promising materials for flexible electronics due to their unique properties, such as high-water content, softness, and biocompatibility. In this perspective, we provide an overview of the development of hydrogels for flexible electronics, with a focus on three key aspects:...
| Main Authors: | , , , , |
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| Other Authors: | |
| Format: | Journal Article |
| Language: | English |
| Published: |
2023
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| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/169207 |
| _version_ | 1811683235345727488 |
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| author | Zhang, Yingchao Tan, Yurong Lao, Jia Zheng Gao, Huajian Yu, Jing |
| author2 | School of Materials Science and Engineering |
| author_facet | School of Materials Science and Engineering Zhang, Yingchao Tan, Yurong Lao, Jia Zheng Gao, Huajian Yu, Jing |
| author_sort | Zhang, Yingchao |
| collection | NTU |
| description | Hydrogels have emerged as promising materials for flexible electronics due to their unique properties, such as high-water content, softness, and biocompatibility. In this perspective, we provide an overview of the development of hydrogels for flexible electronics, with a focus on three key aspects: mechanical properties, interfacial adhesion, and conductivity. We discuss the principles of designing high-performance hydrogels and present representative examples of their potential applications in the field of flexible electronics for healthcare. Despite significant progress, several challenges remain, including improving the anti-fatigue capability, enhancing interfacial adhesion, and balancing water content in wet environments. Additionally, we highlight the importance of considering the hydrogel-cell interactions and the dynamic properties of hydrogels in future research. Looking ahead, the future of hydrogels in flexible electronics is promising, with exciting opportunities on the horizon, but continued investment in research and development is necessary to overcome the remaining challenges. |
| first_indexed | 2024-10-01T04:09:30Z |
| format | Journal Article |
| id | ntu-10356/169207 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2024-10-01T04:09:30Z |
| publishDate | 2023 |
| record_format | dspace |
| spelling | ntu-10356/1692072023-07-14T15:45:46Z Hydrogels for flexible electronics Zhang, Yingchao Tan, Yurong Lao, Jia Zheng Gao, Huajian Yu, Jing School of Materials Science and Engineering School of Mechanical and Aerospace Engineering Institute of High Performance Computing, A*STAR Engineering::Materials Flexible Electronics Hydrogels Mechanical Properties Adhesion Conductivity Hydrogels have emerged as promising materials for flexible electronics due to their unique properties, such as high-water content, softness, and biocompatibility. In this perspective, we provide an overview of the development of hydrogels for flexible electronics, with a focus on three key aspects: mechanical properties, interfacial adhesion, and conductivity. We discuss the principles of designing high-performance hydrogels and present representative examples of their potential applications in the field of flexible electronics for healthcare. Despite significant progress, several challenges remain, including improving the anti-fatigue capability, enhancing interfacial adhesion, and balancing water content in wet environments. Additionally, we highlight the importance of considering the hydrogel-cell interactions and the dynamic properties of hydrogels in future research. Looking ahead, the future of hydrogels in flexible electronics is promising, with exciting opportunities on the horizon, but continued investment in research and development is necessary to overcome the remaining challenges. Agency for Science, Technology and Research (A*STAR) Ministry of Education (MOE) Nanyang Technological University National Research Foundation (NRF) Submitted/Accepted version The authors acknowledge the AME programmatic funding scheme of Cyber Physiochemical Interfaces (CPI) project #A18A1b0045 and the Singapore Ministry of Education (MOE) Tier 2 Grant (MOE-T2EP30220-0006). Y. Tan is supported by the National Research Foundation, Singapore (NRF) under NRF’s Medium Sized Centre: Singapore Hybrid-Integrated Next-Generation μ-Electronics (SHINE) Centre funding programme. J. Lao acknowledges the research scholarship awarded by the Institute of Flexible Electronics Technology of Tsinghua, Zhejiang (IFET-THU), Nanyang Technological University (NTU), and Qiantang Science and Technology Innovation Center, China (QSTIC). H. Gao acknowledges a start-up grant (002479-00001) from Nanyang Technological University and Agency for Science, Technology and Research (A*STAR). 2023-07-10T06:13:44Z 2023-07-10T06:13:44Z 2023 Journal Article Zhang, Y., Tan, Y., Lao, J. Z., Gao, H. & Yu, J. (2023). Hydrogels for flexible electronics. ACS Nano, 17(11), 9681-9693. https://dx.doi.org/10.1021/acsnano.3c02897 1936-0851 https://hdl.handle.net/10356/169207 10.1021/acsnano.3c02897 11 17 9681 9693 en #A18A1b0045 MOE-T2EP30220-0006 002479-00001 ACS Nano This document is the Accepted Manuscript version of a Published Work that appeared in final form in ACS Nano, copyright © 2023 American Chemical Society, after peer review and technical editing by the publisher. To access the final edited and published work see https://doi.org/10.1021/acsnano.3c02897. application/pdf |
| spellingShingle | Engineering::Materials Flexible Electronics Hydrogels Mechanical Properties Adhesion Conductivity Zhang, Yingchao Tan, Yurong Lao, Jia Zheng Gao, Huajian Yu, Jing Hydrogels for flexible electronics |
| title | Hydrogels for flexible electronics |
| title_full | Hydrogels for flexible electronics |
| title_fullStr | Hydrogels for flexible electronics |
| title_full_unstemmed | Hydrogels for flexible electronics |
| title_short | Hydrogels for flexible electronics |
| title_sort | hydrogels for flexible electronics |
| topic | Engineering::Materials Flexible Electronics Hydrogels Mechanical Properties Adhesion Conductivity |
| url | https://hdl.handle.net/10356/169207 |
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