Uniform etching for failure analysis of integrated circuits
Following the trend towards transistor miniaturization and power efficiency in Integrated Circuits (ICs), the concurrent miniaturization of possible defects challenges Failure Analysis (FA) engineers to accurately deprocess ICs with great precision before accessing the defects. As such, etch uniform...
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| Format: | Final Year Project (FYP) |
| Language: | English |
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Nanyang Technological University
2023
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| Online Access: | https://hdl.handle.net/10356/169222 |