Solventless 3D printed high-temperature resistant cyclosiloxane-containing resin for low-shrinkage ceramization and nano-functional composite development
Digital light processing (DLP) 3D printing technology has the advantage of rapid preparation of high-precision complex devices. However, photosensitive resin's insufficient high-temperature resistance and mechanical properties limit its application in aerospace and structural functional devices...
| Main Authors: | , , , , , |
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| Other Authors: | |
| Format: | Journal Article |
| Language: | English |
| Published: |
2023
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| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/169421 |
| _version_ | 1824456228803182592 |
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| author | Zhou, Zihao Zhou, Xinran Yuan, Xueyu Li, Bing Song, Yujie Liu, Ming |
| author2 | School of Materials Science and Engineering |
| author_facet | School of Materials Science and Engineering Zhou, Zihao Zhou, Xinran Yuan, Xueyu Li, Bing Song, Yujie Liu, Ming |
| author_sort | Zhou, Zihao |
| collection | NTU |
| description | Digital light processing (DLP) 3D printing technology has the advantage of rapid preparation of high-precision complex devices. However, photosensitive resin's insufficient high-temperature resistance and mechanical properties limit its application in aerospace and structural functional devices. Herein, we propose a photosensitive cyclosiloxane-containing resins through thiol-ene click reaction. The UV cured cyclosiloxane-containing resins showed high-temperature resistance (5% weight loss ≈ 400 °C), tunable mechanical properties, low temperature derived ceramics etc. With photosensitive characteristics of the developed systems proven by the photo-rheology studies, printing parameters were calculated by Beer-Lambert's law to achieve precise control of the 3D printed constructs with complex geometries. This study also demonstrates the feasibility of ceramicization of the 3D printed parts and the incorporation of nano-functional materials (MXene, invisible ink) for functional device preparation. |
| first_indexed | 2025-02-19T03:50:46Z |
| format | Journal Article |
| id | ntu-10356/169421 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2025-02-19T03:50:46Z |
| publishDate | 2023 |
| record_format | dspace |
| spelling | ntu-10356/1694212023-07-21T15:45:53Z Solventless 3D printed high-temperature resistant cyclosiloxane-containing resin for low-shrinkage ceramization and nano-functional composite development Zhou, Zihao Zhou, Xinran Yuan, Xueyu Li, Bing Song, Yujie Liu, Ming School of Materials Science and Engineering Engineering::Materials Digital Light Processing Cyclosiloxane Digital light processing (DLP) 3D printing technology has the advantage of rapid preparation of high-precision complex devices. However, photosensitive resin's insufficient high-temperature resistance and mechanical properties limit its application in aerospace and structural functional devices. Herein, we propose a photosensitive cyclosiloxane-containing resins through thiol-ene click reaction. The UV cured cyclosiloxane-containing resins showed high-temperature resistance (5% weight loss ≈ 400 °C), tunable mechanical properties, low temperature derived ceramics etc. With photosensitive characteristics of the developed systems proven by the photo-rheology studies, printing parameters were calculated by Beer-Lambert's law to achieve precise control of the 3D printed constructs with complex geometries. This study also demonstrates the feasibility of ceramicization of the 3D printed parts and the incorporation of nano-functional materials (MXene, invisible ink) for functional device preparation. Published version This work is financially supported by the Fundamental Science Research of Harbin Institute of Technology (No. AUGA2160100119), the National Science Foundation of China (No. 52203019), and Ningbo 3315 Plan (Grant No. 2018A-03-A). 2023-07-18T04:49:30Z 2023-07-18T04:49:30Z 2023 Journal Article Zhou, Z., Zhou, X., Yuan, X., Li, B., Song, Y. & Liu, M. (2023). Solventless 3D printed high-temperature resistant cyclosiloxane-containing resin for low-shrinkage ceramization and nano-functional composite development. Materials & Design, 227, 111740-. https://dx.doi.org/10.1016/j.matdes.2023.111740 0264-1275 https://hdl.handle.net/10356/169421 10.1016/j.matdes.2023.111740 2-s2.0-85148331014 227 111740 en Materials & Design © 2023 The Authors. Published by Elsevier Ltd. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/). application/pdf |
| spellingShingle | Engineering::Materials Digital Light Processing Cyclosiloxane Zhou, Zihao Zhou, Xinran Yuan, Xueyu Li, Bing Song, Yujie Liu, Ming Solventless 3D printed high-temperature resistant cyclosiloxane-containing resin for low-shrinkage ceramization and nano-functional composite development |
| title | Solventless 3D printed high-temperature resistant cyclosiloxane-containing resin for low-shrinkage ceramization and nano-functional composite development |
| title_full | Solventless 3D printed high-temperature resistant cyclosiloxane-containing resin for low-shrinkage ceramization and nano-functional composite development |
| title_fullStr | Solventless 3D printed high-temperature resistant cyclosiloxane-containing resin for low-shrinkage ceramization and nano-functional composite development |
| title_full_unstemmed | Solventless 3D printed high-temperature resistant cyclosiloxane-containing resin for low-shrinkage ceramization and nano-functional composite development |
| title_short | Solventless 3D printed high-temperature resistant cyclosiloxane-containing resin for low-shrinkage ceramization and nano-functional composite development |
| title_sort | solventless 3d printed high temperature resistant cyclosiloxane containing resin for low shrinkage ceramization and nano functional composite development |
| topic | Engineering::Materials Digital Light Processing Cyclosiloxane |
| url | https://hdl.handle.net/10356/169421 |
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