Thermal modelling of integrated liquid cooling solutions for 3D stacked silicon modules
With the advancement in technologies, miniaturisation of electronic components has increased the demand on highly sophisticated cooling solution to remove heat from the high power density compact electronic device. A liquid cooling solution was designed previously for a three-dimensional (3D) silic...
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| Format: | Final Year Project (FYP) |
| Language: | English |
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2009
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| Online Access: | http://hdl.handle.net/10356/17139 |