Development of key wafer-level packaging technologies and design rules for MEMS and biomedical MEMS
Three etching masking technologies of Cr/Au, Cr/Cu and PECVD amorphous silicon are developed for Pyrex glass micromachining in the hydrofluoric acid solution. Our study reveals that the residual stress, especially the tensile stress, in the mask layers is responsible for the pinholes on the glass su...
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| Format: | Research Report |
| Language: | English |
| Published: |
2009
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| Online Access: | http://hdl.handle.net/10356/17245 |