High-precision resistivity measurement of silicon wafer under unstable lift-off distance using inductive and laser sensors-integrated probe
This article proposes a novel contactless method to measure the resistivity of silicon (Si) wafer. In this method, the probe is designed and integrated with an inductive sensor and a laser sensor. The inductive sensor measures the resistivity of Si wafer, and at the same time, the laser sensor detec...
| Asıl Yazarlar: | , , , , |
|---|---|
| Diğer Yazarlar: | |
| Materyal Türü: | Journal Article |
| Dil: | English |
| Baskı/Yayın Bilgisi: |
2024
|
| Konular: | |
| Online Erişim: | https://hdl.handle.net/10356/173477 |