High-precision resistivity measurement of silicon wafer under unstable lift-off distance using inductive and laser sensors-integrated probe
This article proposes a novel contactless method to measure the resistivity of silicon (Si) wafer. In this method, the probe is designed and integrated with an inductive sensor and a laser sensor. The inductive sensor measures the resistivity of Si wafer, and at the same time, the laser sensor detec...
Main Authors: | Qu, Zilian, Wang, Wensong, Yang, Zhengchun, Bao, Qiwen, Li, Xueli |
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Other Authors: | School of Electrical and Electronic Engineering |
Format: | Journal Article |
Language: | English |
Published: |
2024
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Subjects: | |
Online Access: | https://hdl.handle.net/10356/173477 |
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