Thermomechanical properties of Zeta (Ag₃In) phase
The thermomechanical properties of materials within die-attach joints play an essential role in assessing the reliability of high-power modules. Ag-In transient liquid phase (TLP) bonding serves as an alternative method for die attachment. However, relevant material data for the ζ (Ag3In) phase, one...
| Main Authors: | , , , , |
|---|---|
| Other Authors: | |
| Format: | Journal Article |
| Language: | English |
| Published: |
2024
|
| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/173816 |
| _version_ | 1826115762464489472 |
|---|---|
| author | Liu, Xunda Tatsumi, Hiroaki Jin, Zhi Chen, Zhong Nishikawa, Hiroshi |
| author2 | School of Materials Science and Engineering |
| author_facet | School of Materials Science and Engineering Liu, Xunda Tatsumi, Hiroaki Jin, Zhi Chen, Zhong Nishikawa, Hiroshi |
| author_sort | Liu, Xunda |
| collection | NTU |
| description | The thermomechanical properties of materials within die-attach joints play an essential role in assessing the reliability of high-power modules. Ag-In transient liquid phase (TLP) bonding serves as an alternative method for die attachment. However, relevant material data for the ζ (Ag3In) phase, one of the Ag-In intermetallic compound (IMC) products of TLP bonding, are limited. This paper proposes an approach to fabricate a densified and pure bulk sample of the ζ (Ag3In) phase. The thermomechanical properties of the ζ (Ag3In) phase were subsequently investigated at elevated temperatures and compared to those of other IMCs frequently observed in die-attach joints. As the temperature increased from 30 °C to 200 °C, the hardness of the ζ (Ag3In) phase decreased linearly from 1.78 GPa to 1.46 GPa. Similarly, the Young's modulus also decreased linearly from 82.3 GPa to 66.5 GPa. These properties rank among the lowest levels compared to those of other IMCs. The average coefficient of thermal expansion within the temperature range of 70 °C to 250 °C was approximately 18.63 ± 0.61 μm/m/°C, placing the ζ (Ag3In) phase at a moderate level. When considering its potential for mitigating thermal stress, these combined properties render the ζ (Ag3In) phase an appropriate material choice for die-attach joints compared to other IMCs. |
| first_indexed | 2024-10-01T04:00:28Z |
| format | Journal Article |
| id | ntu-10356/173816 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2024-10-01T04:00:28Z |
| publishDate | 2024 |
| record_format | dspace |
| spelling | ntu-10356/1738162024-03-01T15:46:08Z Thermomechanical properties of Zeta (Ag₃In) phase Liu, Xunda Tatsumi, Hiroaki Jin, Zhi Chen, Zhong Nishikawa, Hiroshi School of Materials Science and Engineering Engineering Intermetallic compounds Transient liquid phase bonding The thermomechanical properties of materials within die-attach joints play an essential role in assessing the reliability of high-power modules. Ag-In transient liquid phase (TLP) bonding serves as an alternative method for die attachment. However, relevant material data for the ζ (Ag3In) phase, one of the Ag-In intermetallic compound (IMC) products of TLP bonding, are limited. This paper proposes an approach to fabricate a densified and pure bulk sample of the ζ (Ag3In) phase. The thermomechanical properties of the ζ (Ag3In) phase were subsequently investigated at elevated temperatures and compared to those of other IMCs frequently observed in die-attach joints. As the temperature increased from 30 °C to 200 °C, the hardness of the ζ (Ag3In) phase decreased linearly from 1.78 GPa to 1.46 GPa. Similarly, the Young's modulus also decreased linearly from 82.3 GPa to 66.5 GPa. These properties rank among the lowest levels compared to those of other IMCs. The average coefficient of thermal expansion within the temperature range of 70 °C to 250 °C was approximately 18.63 ± 0.61 μm/m/°C, placing the ζ (Ag3In) phase at a moderate level. When considering its potential for mitigating thermal stress, these combined properties render the ζ (Ag3In) phase an appropriate material choice for die-attach joints compared to other IMCs. Published version This research was funded by JST SPRING, grant number JPMJSP2138. 2024-02-28T08:45:36Z 2024-02-28T08:45:36Z 2023 Journal Article Liu, X., Tatsumi, H., Jin, Z., Chen, Z. & Nishikawa, H. (2023). Thermomechanical properties of Zeta (Ag₃In) phase. Materials, 16(22), 7115-. https://dx.doi.org/10.3390/ma16227115 1996-1944 https://hdl.handle.net/10356/173816 10.3390/ma16227115 38005045 2-s2.0-85177858045 22 16 7115 en Materials © 2023 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https:// creativecommons.org/licenses/by/ 4.0/). application/pdf |
| spellingShingle | Engineering Intermetallic compounds Transient liquid phase bonding Liu, Xunda Tatsumi, Hiroaki Jin, Zhi Chen, Zhong Nishikawa, Hiroshi Thermomechanical properties of Zeta (Ag₃In) phase |
| title | Thermomechanical properties of Zeta (Ag₃In) phase |
| title_full | Thermomechanical properties of Zeta (Ag₃In) phase |
| title_fullStr | Thermomechanical properties of Zeta (Ag₃In) phase |
| title_full_unstemmed | Thermomechanical properties of Zeta (Ag₃In) phase |
| title_short | Thermomechanical properties of Zeta (Ag₃In) phase |
| title_sort | thermomechanical properties of zeta ag₃in phase |
| topic | Engineering Intermetallic compounds Transient liquid phase bonding |
| url | https://hdl.handle.net/10356/173816 |
| work_keys_str_mv | AT liuxunda thermomechanicalpropertiesofzetaag3inphase AT tatsumihiroaki thermomechanicalpropertiesofzetaag3inphase AT jinzhi thermomechanicalpropertiesofzetaag3inphase AT chenzhong thermomechanicalpropertiesofzetaag3inphase AT nishikawahiroshi thermomechanicalpropertiesofzetaag3inphase |