Thermoformable conductive compositions for printed electronics
The development of three-dimensional printed electronics has garnered significant interest due to the ease of integration of electronic circuitry on 3D surfaces. However, it is still very challenging to achieve the desired conformability, stretchability, and adhesion of conductive pastes used for pr...
| Main Authors: | , , |
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| Other Authors: | |
| Format: | Journal Article |
| Language: | English |
| Published: |
2024
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| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/173979 |
| _version_ | 1811691946508288000 |
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| author | Seyed Ismail Seyed Shahabadi Tan, Joel Ming Rui Magdassi, Shlomo |
| author2 | School of Materials Science and Engineering |
| author_facet | School of Materials Science and Engineering Seyed Ismail Seyed Shahabadi Tan, Joel Ming Rui Magdassi, Shlomo |
| author_sort | Seyed Ismail Seyed Shahabadi |
| collection | NTU |
| description | The development of three-dimensional printed electronics has garnered significant interest due to the ease of integration of electronic circuitry on 3D surfaces. However, it is still very challenging to achieve the desired conformability, stretchability, and adhesion of conductive pastes used for printing on thermoformable substrates. In this study, we propose the use of novel thermoformable ink composed of copper flakes coated with silver, which enables us to prevent the oxidation of copper, instead of the commonly used silver inks. Various polymer/solvent/flake systems were investigated, resulting in thermoformable conductive printing compositions that can be sintered under air. The best inks were screen printed on PC substrates and were thermoformed using molds with different degrees of strain. The effects of the various components on the thermoforming ability and the electrical properties and morphology of the resulting 3D structures were studied. The best inks resulted in a low sheet resistivity, 100 mΩ/□/mil and 500 mΩ/□/mil before and after thermoforming at 20%, respectively. The feasibility of using the best ink was demonstrated for the fabrication of a thermoformable 3D RFID antenna on PC substrates. |
| first_indexed | 2024-10-01T06:27:58Z |
| format | Journal Article |
| id | ntu-10356/173979 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2024-10-01T06:27:58Z |
| publishDate | 2024 |
| record_format | dspace |
| spelling | ntu-10356/1739792024-03-08T15:45:58Z Thermoformable conductive compositions for printed electronics Seyed Ismail Seyed Shahabadi Tan, Joel Ming Rui Magdassi, Shlomo School of Materials Science and Engineering Singapore-HUJ Alliance for Research and Enterprise (SHARE) Engineering Printed electronics Thermoforming The development of three-dimensional printed electronics has garnered significant interest due to the ease of integration of electronic circuitry on 3D surfaces. However, it is still very challenging to achieve the desired conformability, stretchability, and adhesion of conductive pastes used for printing on thermoformable substrates. In this study, we propose the use of novel thermoformable ink composed of copper flakes coated with silver, which enables us to prevent the oxidation of copper, instead of the commonly used silver inks. Various polymer/solvent/flake systems were investigated, resulting in thermoformable conductive printing compositions that can be sintered under air. The best inks were screen printed on PC substrates and were thermoformed using molds with different degrees of strain. The effects of the various components on the thermoforming ability and the electrical properties and morphology of the resulting 3D structures were studied. The best inks resulted in a low sheet resistivity, 100 mΩ/□/mil and 500 mΩ/□/mil before and after thermoforming at 20%, respectively. The feasibility of using the best ink was demonstrated for the fabrication of a thermoformable 3D RFID antenna on PC substrates. National Research Foundation (NRF) Published version This research is partially supported by a grant from the National Research Foundation, Prime Minister’s Office, Singapore, under its Campus of Research Excellence and Technological Enterprise (CREATE) program (SGSR and NEW programs) and by AMat Singapore. 2024-03-08T07:39:15Z 2024-03-08T07:39:15Z 2023 Journal Article Seyed Ismail Seyed Shahabadi, Tan, J. M. R. & Magdassi, S. (2023). Thermoformable conductive compositions for printed electronics. Coatings, 13(9), 1548-. https://dx.doi.org/10.3390/coatings13091548 2079-6412 https://hdl.handle.net/10356/173979 10.3390/coatings13091548 2-s2.0-85172774889 9 13 1548 en Coatings © 2023 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https:// creativecommons.org/licenses/by/ 4.0/). application/pdf |
| spellingShingle | Engineering Printed electronics Thermoforming Seyed Ismail Seyed Shahabadi Tan, Joel Ming Rui Magdassi, Shlomo Thermoformable conductive compositions for printed electronics |
| title | Thermoformable conductive compositions for printed electronics |
| title_full | Thermoformable conductive compositions for printed electronics |
| title_fullStr | Thermoformable conductive compositions for printed electronics |
| title_full_unstemmed | Thermoformable conductive compositions for printed electronics |
| title_short | Thermoformable conductive compositions for printed electronics |
| title_sort | thermoformable conductive compositions for printed electronics |
| topic | Engineering Printed electronics Thermoforming |
| url | https://hdl.handle.net/10356/173979 |
| work_keys_str_mv | AT seyedismailseyedshahabadi thermoformableconductivecompositionsforprintedelectronics AT tanjoelmingrui thermoformableconductivecompositionsforprintedelectronics AT magdassishlomo thermoformableconductivecompositionsforprintedelectronics |