Thermoformable conductive compositions for printed electronics
The development of three-dimensional printed electronics has garnered significant interest due to the ease of integration of electronic circuitry on 3D surfaces. However, it is still very challenging to achieve the desired conformability, stretchability, and adhesion of conductive pastes used for pr...
| Main Authors: | , , |
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| Other Authors: | |
| Format: | Journal Article |
| Language: | English |
| Published: |
2024
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| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/173979 |