Towards building silicon photonics LiDAR chip
Light detection and ranging (LiDAR) is an excellent sensor for 3D imaging applications. However, the bulkiness and high cost of LiDARs hinder LiDAR from expanding its applications. Advancement in research evaluated that solid-state devices can lower the high cost of LiDARs. Furthermore, if we can in...
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| Format: | Final Year Project (FYP) |
| Language: | English |
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Nanyang Technological University
2024
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| Online Access: | https://hdl.handle.net/10356/176899 |
| Summary: | Light detection and ranging (LiDAR) is an excellent sensor for 3D imaging applications. However, the bulkiness and high cost of LiDARs hinder LiDAR from expanding its applications. Advancement in research evaluated that solid-state devices can lower the high cost of LiDARs. Furthermore, if we can integrate the LiDAR components into a small photonic integrated chip (PIC), we can significantly reduce the bulkiness of LiDAR. Hence, this project will investigate the usage of PIC-OPA for LiDAR applications. |
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