Towards building silicon photonics LiDAR chip
Light detection and ranging (LiDAR) is an excellent sensor for 3D imaging applications. However, the bulkiness and high cost of LiDARs hinder LiDAR from expanding its applications. Advancement in research evaluated that solid-state devices can lower the high cost of LiDARs. Furthermore, if we can in...
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| Format: | Final Year Project (FYP) |
| Language: | English |
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Nanyang Technological University
2024
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| Online Access: | https://hdl.handle.net/10356/176899 |
| _version_ | 1826113533562060800 |
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| author | Goh, Cai Yu |
| author2 | Nam Donguk |
| author_facet | Nam Donguk Goh, Cai Yu |
| author_sort | Goh, Cai Yu |
| collection | NTU |
| description | Light detection and ranging (LiDAR) is an excellent sensor for 3D imaging applications. However, the bulkiness and high cost of LiDARs hinder LiDAR from expanding its applications. Advancement in research evaluated that solid-state devices can lower the high cost of LiDARs. Furthermore, if we can integrate the LiDAR components into a small photonic integrated chip (PIC), we can significantly reduce the bulkiness of LiDAR. Hence, this project will investigate the usage of PIC-OPA for LiDAR applications. |
| first_indexed | 2024-10-01T03:24:47Z |
| format | Final Year Project (FYP) |
| id | ntu-10356/176899 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2024-10-01T03:24:47Z |
| publishDate | 2024 |
| publisher | Nanyang Technological University |
| record_format | dspace |
| spelling | ntu-10356/1768992024-05-24T15:43:52Z Towards building silicon photonics LiDAR chip Goh, Cai Yu Nam Donguk School of Electrical and Electronic Engineering dnam@ntu.edu.sg Engineering LiDAR Light detection and ranging (LiDAR) is an excellent sensor for 3D imaging applications. However, the bulkiness and high cost of LiDARs hinder LiDAR from expanding its applications. Advancement in research evaluated that solid-state devices can lower the high cost of LiDARs. Furthermore, if we can integrate the LiDAR components into a small photonic integrated chip (PIC), we can significantly reduce the bulkiness of LiDAR. Hence, this project will investigate the usage of PIC-OPA for LiDAR applications. Bachelor's degree 2024-05-23T04:39:14Z 2024-05-23T04:39:14Z 2024 Final Year Project (FYP) Goh, C. Y. (2024). Towards building silicon photonics LiDAR chip. Final Year Project (FYP), Nanyang Technological University, Singapore. https://hdl.handle.net/10356/176899 https://hdl.handle.net/10356/176899 en A2146-231 application/pdf Nanyang Technological University |
| spellingShingle | Engineering LiDAR Goh, Cai Yu Towards building silicon photonics LiDAR chip |
| title | Towards building silicon photonics LiDAR chip |
| title_full | Towards building silicon photonics LiDAR chip |
| title_fullStr | Towards building silicon photonics LiDAR chip |
| title_full_unstemmed | Towards building silicon photonics LiDAR chip |
| title_short | Towards building silicon photonics LiDAR chip |
| title_sort | towards building silicon photonics lidar chip |
| topic | Engineering LiDAR |
| url | https://hdl.handle.net/10356/176899 |
| work_keys_str_mv | AT gohcaiyu towardsbuildingsiliconphotonicslidarchip |