Simulation and characterization of wide band gap power semiconductor devices

Wide bandgap (WBG) semiconductors play a pivotal role in improving the efficiency of power electronics due to their exceptional performance characteristics, such as higher reverse breakdown voltage, higher operating temperature, higher frequency, and compact converter size. However, the superiority...

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Main Author: Wu, Yuxin
Other Authors: Wong Kin Shun, Terence
Format: Thesis-Master by Coursework
Language:English
Published: Nanyang Technological University 2024
Subjects:
Online Access:https://hdl.handle.net/10356/179953
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author Wu, Yuxin
author2 Wong Kin Shun, Terence
author_facet Wong Kin Shun, Terence
Wu, Yuxin
author_sort Wu, Yuxin
collection NTU
description Wide bandgap (WBG) semiconductors play a pivotal role in improving the efficiency of power electronics due to their exceptional performance characteristics, such as higher reverse breakdown voltage, higher operating temperature, higher frequency, and compact converter size. However, the superiority of WBG semiconductors over traditional silicon ones in power converters is still debatable. In this project, we investigate the performance of silicon carbide (SiC) which is one of the most representative WBG semiconductors, and compare it with silicon (Si) semiconductor devices using PLECS simulator across various converter types and input voltage ranges from 100V to 800V, focusing on voltage and current, MOSFET junction temperature, and converter efficiency, which are primary characteristics to determine the performance of devices. Results from simulations show SiC MOSFETs have better thermal performance, maintaining lower junction temperatures than Si MOSFETs, especially at higher input voltages. Furthermore, SiC maintains stable high efficiency in high-voltage applications across four various converters. Si remains comparable efficiency at lower voltages and advantageous in the DC-DC Buck converter below 200V and DC-DC Boost converter below 600 V due to its cost and manufacturing advantages. Therefore, the selection between Si and SiC semiconductors relies on specific application needs. SiC is ideal for high-voltage, high-efficiency, and thermally demanding applications, while Si remains relevant for cost-sensitive, lower-voltage scenarios, particularly in DC-DC converter applications.
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spelling ntu-10356/1799532024-09-06T15:43:55Z Simulation and characterization of wide band gap power semiconductor devices Wu, Yuxin Wong Kin Shun, Terence School of Electrical and Electronic Engineering EKSWONG@ntu.edu.sg Engineering Silicon carbide Wide band gap Wide bandgap (WBG) semiconductors play a pivotal role in improving the efficiency of power electronics due to their exceptional performance characteristics, such as higher reverse breakdown voltage, higher operating temperature, higher frequency, and compact converter size. However, the superiority of WBG semiconductors over traditional silicon ones in power converters is still debatable. In this project, we investigate the performance of silicon carbide (SiC) which is one of the most representative WBG semiconductors, and compare it with silicon (Si) semiconductor devices using PLECS simulator across various converter types and input voltage ranges from 100V to 800V, focusing on voltage and current, MOSFET junction temperature, and converter efficiency, which are primary characteristics to determine the performance of devices. Results from simulations show SiC MOSFETs have better thermal performance, maintaining lower junction temperatures than Si MOSFETs, especially at higher input voltages. Furthermore, SiC maintains stable high efficiency in high-voltage applications across four various converters. Si remains comparable efficiency at lower voltages and advantageous in the DC-DC Buck converter below 200V and DC-DC Boost converter below 600 V due to its cost and manufacturing advantages. Therefore, the selection between Si and SiC semiconductors relies on specific application needs. SiC is ideal for high-voltage, high-efficiency, and thermally demanding applications, while Si remains relevant for cost-sensitive, lower-voltage scenarios, particularly in DC-DC converter applications. Master's degree 2024-09-05T06:00:07Z 2024-09-05T06:00:07Z 2024 Thesis-Master by Coursework Wu, Y. (2024). Simulation and characterization of wide band gap power semiconductor devices. Master's thesis, Nanyang Technological University, Singapore. https://hdl.handle.net/10356/179953 https://hdl.handle.net/10356/179953 en application/pdf Nanyang Technological University
spellingShingle Engineering
Silicon carbide
Wide band gap
Wu, Yuxin
Simulation and characterization of wide band gap power semiconductor devices
title Simulation and characterization of wide band gap power semiconductor devices
title_full Simulation and characterization of wide band gap power semiconductor devices
title_fullStr Simulation and characterization of wide band gap power semiconductor devices
title_full_unstemmed Simulation and characterization of wide band gap power semiconductor devices
title_short Simulation and characterization of wide band gap power semiconductor devices
title_sort simulation and characterization of wide band gap power semiconductor devices
topic Engineering
Silicon carbide
Wide band gap
url https://hdl.handle.net/10356/179953
work_keys_str_mv AT wuyuxin simulationandcharacterizationofwidebandgappowersemiconductordevices