System design and characterisation of integrated liquid cooling solutions for 3D-stacked modules
Heat densities for electronic packages are increasing as the demand for many functionalities on a single package had resulted in single chip modules being stacked vertically to increase the amount of transistors that can be put on a given footprint. In this study, a liquid cooling solution is propos...
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| Format: | Thesis |
| Language: | English |
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2009
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| Online Access: | https://hdl.handle.net/10356/18664 |