Development of process technology for fabrication of 4H-SiC silicon carbide schottky barrier diodes

In recent times, 4H-SiC has been at the center of power semiconductor device research due to its superior material properties such as large bandgap (Eg ~3.26 eV), high breakdown electric field (Ec ~3 MV/cm which is almost 10 times that of Si), high saturated electron velocity (~2.0×107 cm/s which is...

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Main Author: Kumta Amit Sudhakar
Other Authors: Rusli
Format: Thesis
Language:English
Published: 2009
Subjects:
Online Access:https://hdl.handle.net/10356/19273
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author Kumta Amit Sudhakar
author2 Rusli
author_facet Rusli
Kumta Amit Sudhakar
author_sort Kumta Amit Sudhakar
collection NTU
description In recent times, 4H-SiC has been at the center of power semiconductor device research due to its superior material properties such as large bandgap (Eg ~3.26 eV), high breakdown electric field (Ec ~3 MV/cm which is almost 10 times that of Si), high saturated electron velocity (~2.0×107 cm/s which is almost 2 times that in Si), high thermal conductivity (K ~4.9 W/cm.K) and most importantly ability to form a stable native oxide SiO2. Schottky barrier diodes (SBDs) based on 4H-SiC offer superior dynamic performance (<20 nC reverse recovery charge for a 1200 V, 1A SBD), almost 100 times lower specific-on resistance compared to Si SBDs and PiN diodes. The higher bandgap results in much higher schottky barrier height compared to Si and GaAs resulting in extremely low leakage currents even at elevated temperatures (>300oC operation).
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spelling ntu-10356/192732023-07-04T17:02:24Z Development of process technology for fabrication of 4H-SiC silicon carbide schottky barrier diodes Kumta Amit Sudhakar Rusli School of Electrical and Electronic Engineering DRNTU::Engineering::Materials::Microelectronics and semiconductor materials In recent times, 4H-SiC has been at the center of power semiconductor device research due to its superior material properties such as large bandgap (Eg ~3.26 eV), high breakdown electric field (Ec ~3 MV/cm which is almost 10 times that of Si), high saturated electron velocity (~2.0×107 cm/s which is almost 2 times that in Si), high thermal conductivity (K ~4.9 W/cm.K) and most importantly ability to form a stable native oxide SiO2. Schottky barrier diodes (SBDs) based on 4H-SiC offer superior dynamic performance (<20 nC reverse recovery charge for a 1200 V, 1A SBD), almost 100 times lower specific-on resistance compared to Si SBDs and PiN diodes. The higher bandgap results in much higher schottky barrier height compared to Si and GaAs resulting in extremely low leakage currents even at elevated temperatures (>300oC operation). DOCTOR OF PHILOSOPHY (EEE) 2009-11-16T05:57:29Z 2009-11-16T05:57:29Z 2009 2009 Thesis Kumta Amit Sudhakar. (2009). Development of process technology for fabrication of 4H-SiC silicon carbide schottky barrier diodes. Doctoral thesis, Nanyang Technological University, Singapore. https://hdl.handle.net/10356/19273 10.32657/10356/19273 en 193 p. application/pdf
spellingShingle DRNTU::Engineering::Materials::Microelectronics and semiconductor materials
Kumta Amit Sudhakar
Development of process technology for fabrication of 4H-SiC silicon carbide schottky barrier diodes
title Development of process technology for fabrication of 4H-SiC silicon carbide schottky barrier diodes
title_full Development of process technology for fabrication of 4H-SiC silicon carbide schottky barrier diodes
title_fullStr Development of process technology for fabrication of 4H-SiC silicon carbide schottky barrier diodes
title_full_unstemmed Development of process technology for fabrication of 4H-SiC silicon carbide schottky barrier diodes
title_short Development of process technology for fabrication of 4H-SiC silicon carbide schottky barrier diodes
title_sort development of process technology for fabrication of 4h sic silicon carbide schottky barrier diodes
topic DRNTU::Engineering::Materials::Microelectronics and semiconductor materials
url https://hdl.handle.net/10356/19273
work_keys_str_mv AT kumtaamitsudhakar developmentofprocesstechnologyforfabricationof4hsicsiliconcarbideschottkybarrierdiodes