Biomolecules for nanodevice applications
The density of devices needs to be integrated into various systems increases with the advancement in technology. In order to integrate high density of devices, smaller feature size down to nanometer level has to be achieved. With the current technology, copper may no longer be suitable as interconne...
Main Author: | Yew, Sok Yee |
---|---|
Other Authors: | Lam Yeng Ming |
Format: | Thesis |
Language: | English |
Published: |
2009
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Subjects: | |
Online Access: | https://hdl.handle.net/10356/19305 |
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