Design of heat tunnel for a wire bonder
This project aims to develop a heat tunnel work-handling system for a wire bonder. The wire bonder machine is used in semiconductor industry to connect bonding pads on silicon chips to the leads on the leadframes. The design requirement of this new system is to enable bare copper leadframe to be use...
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| Other Authors: | |
| Format: | Thesis |
| Language: | English |
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2009
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| Online Access: | http://hdl.handle.net/10356/19935 |
| _version_ | 1824456847875112960 |
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| author | Goh, Swee Leong. |
| author2 | Hsiung, Hank |
| author_facet | Hsiung, Hank Goh, Swee Leong. |
| author_sort | Goh, Swee Leong. |
| collection | NTU |
| description | This project aims to develop a heat tunnel work-handling system for a wire bonder. The wire bonder machine is used in semiconductor industry to connect bonding pads on silicon chips to the leads on the leadframes. The design requirement of this new system is to enable bare copper leadframe to be used in the machine. The die attach material between die and bare copper leadframe after die-attach can also be cured within the heat tunnel system before the wire bonding process. |
| first_indexed | 2025-02-19T04:00:37Z |
| format | Thesis |
| id | ntu-10356/19935 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2025-02-19T04:00:37Z |
| publishDate | 2009 |
| record_format | dspace |
| spelling | ntu-10356/199352023-03-11T17:20:25Z Design of heat tunnel for a wire bonder Goh, Swee Leong. Hsiung, Hank School of Mechanical and Production Engineering DRNTU::Engineering::Manufacturing This project aims to develop a heat tunnel work-handling system for a wire bonder. The wire bonder machine is used in semiconductor industry to connect bonding pads on silicon chips to the leads on the leadframes. The design requirement of this new system is to enable bare copper leadframe to be used in the machine. The die attach material between die and bare copper leadframe after die-attach can also be cured within the heat tunnel system before the wire bonding process. Master of Science (Precision Engineering) 2009-12-14T07:52:04Z 2009-12-14T07:52:04Z 1997 1997 Thesis http://hdl.handle.net/10356/19935 en NANYANG TECHNOLOGICAL UNIVERSITY 79 p. application/pdf |
| spellingShingle | DRNTU::Engineering::Manufacturing Goh, Swee Leong. Design of heat tunnel for a wire bonder |
| title | Design of heat tunnel for a wire bonder |
| title_full | Design of heat tunnel for a wire bonder |
| title_fullStr | Design of heat tunnel for a wire bonder |
| title_full_unstemmed | Design of heat tunnel for a wire bonder |
| title_short | Design of heat tunnel for a wire bonder |
| title_sort | design of heat tunnel for a wire bonder |
| topic | DRNTU::Engineering::Manufacturing |
| url | http://hdl.handle.net/10356/19935 |
| work_keys_str_mv | AT gohsweeleong designofheattunnelforawirebonder |