Design of heat tunnel for a wire bonder
This project aims to develop a heat tunnel work-handling system for a wire bonder. The wire bonder machine is used in semiconductor industry to connect bonding pads on silicon chips to the leads on the leadframes. The design requirement of this new system is to enable bare copper leadframe to be use...
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| Format: | Thesis |
| Language: | English |
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2009
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| Online Access: | http://hdl.handle.net/10356/19935 |