Feasibility study of a quick cure process using a conventional belt furnace
Over the years, die attach of cerdip packages had transformed from eutectic die bonding to silver glass die attach. But this material had a drawback. It had to be cured in a furnace at a temperature >400°C and its cycle time was generally about an hour. For optimal cure, the furnace profile was c...
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| Other Authors: | |
| Format: | Thesis |
| Language: | English |
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2009
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| Online Access: | http://hdl.handle.net/10356/20004 |
| _version_ | 1811691647387303936 |
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| author | Kwan, Yew Kee. |
| author2 | Boey, Freddy Yin Chiang |
| author_facet | Boey, Freddy Yin Chiang Kwan, Yew Kee. |
| author_sort | Kwan, Yew Kee. |
| collection | NTU |
| description | Over the years, die attach of cerdip packages had transformed from eutectic die bonding to silver glass die attach. But this material had a drawback. It had to be cured in a furnace at a temperature >400°C and its cycle time was generally about an hour. For optimal cure, the furnace profile was critical. In a typical cerdip assembly process, cure and sealwere 2 processes that attributed the longest cycle time. Rapid cure was a possible solution to cycle time reduction. Presently, technology was available for plastic packages but not for cerdip. The author visualised that rapid cure would revolutionarise die attach curing process for ceramic packages once a production model was available. The criterion for rapid cure was short cure time. |
| first_indexed | 2024-10-01T06:23:13Z |
| format | Thesis |
| id | ntu-10356/20004 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2024-10-01T06:23:13Z |
| publishDate | 2009 |
| record_format | dspace |
| spelling | ntu-10356/200042023-03-11T17:28:24Z Feasibility study of a quick cure process using a conventional belt furnace Kwan, Yew Kee. Boey, Freddy Yin Chiang School of Mechanical and Production Engineering DRNTU::Engineering::Manufacturing::Product engineering Over the years, die attach of cerdip packages had transformed from eutectic die bonding to silver glass die attach. But this material had a drawback. It had to be cured in a furnace at a temperature >400°C and its cycle time was generally about an hour. For optimal cure, the furnace profile was critical. In a typical cerdip assembly process, cure and sealwere 2 processes that attributed the longest cycle time. Rapid cure was a possible solution to cycle time reduction. Presently, technology was available for plastic packages but not for cerdip. The author visualised that rapid cure would revolutionarise die attach curing process for ceramic packages once a production model was available. The criterion for rapid cure was short cure time. Master of Science (Mechanics & Processing of Materials) 2009-12-14T07:56:59Z 2009-12-14T07:56:59Z 1996 1996 Thesis http://hdl.handle.net/10356/20004 en NANYANG TECHNOLOGICAL UNIVERSITY 170 p. application/pdf |
| spellingShingle | DRNTU::Engineering::Manufacturing::Product engineering Kwan, Yew Kee. Feasibility study of a quick cure process using a conventional belt furnace |
| title | Feasibility study of a quick cure process using a conventional belt furnace |
| title_full | Feasibility study of a quick cure process using a conventional belt furnace |
| title_fullStr | Feasibility study of a quick cure process using a conventional belt furnace |
| title_full_unstemmed | Feasibility study of a quick cure process using a conventional belt furnace |
| title_short | Feasibility study of a quick cure process using a conventional belt furnace |
| title_sort | feasibility study of a quick cure process using a conventional belt furnace |
| topic | DRNTU::Engineering::Manufacturing::Product engineering |
| url | http://hdl.handle.net/10356/20004 |
| work_keys_str_mv | AT kwanyewkee feasibilitystudyofaquickcureprocessusingaconventionalbeltfurnace |