Computer aided IC packaging design
In recent years knowledge based applications have gained access in many areas of engineering. This kind of approach is particularly appropriate, among others, in solving problems related to selection, classification, configuration, diagnosis, monitoring and planning.
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| Other Authors: | |
| Format: | Thesis |
| Language: | English |
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2009
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| Online Access: | http://hdl.handle.net/10356/20525 |
| _version_ | 1811692948714160128 |
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| author | Zahiruddin A. K. M. |
| author2 | Song, Bin |
| author_facet | Song, Bin Zahiruddin A. K. M. |
| author_sort | Zahiruddin A. K. M. |
| collection | NTU |
| description | In recent years knowledge based applications have gained access in many areas of engineering. This kind of approach is particularly appropriate, among others, in solving problems related to selection, classification, configuration, diagnosis, monitoring and planning. |
| first_indexed | 2024-10-01T06:43:54Z |
| format | Thesis |
| id | ntu-10356/20525 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2024-10-01T06:43:54Z |
| publishDate | 2009 |
| record_format | dspace |
| spelling | ntu-10356/205252020-09-26T22:13:33Z Computer aided IC packaging design Zahiruddin A. K. M. Song, Bin Gintic Institute of Manufacturing Technology DRNTU::Engineering::Manufacturing::CAD/CAM systems In recent years knowledge based applications have gained access in many areas of engineering. This kind of approach is particularly appropriate, among others, in solving problems related to selection, classification, configuration, diagnosis, monitoring and planning. Master of Science (Computer Integrated Manufacturing) 2009-12-15T03:16:49Z 2009-12-15T03:16:49Z 1998 1998 Thesis http://hdl.handle.net/10356/20525 en NANYANG TECHNOLOGICAL UNIVERSITY 104 p. application/pdf |
| spellingShingle | DRNTU::Engineering::Manufacturing::CAD/CAM systems Zahiruddin A. K. M. Computer aided IC packaging design |
| title | Computer aided IC packaging design |
| title_full | Computer aided IC packaging design |
| title_fullStr | Computer aided IC packaging design |
| title_full_unstemmed | Computer aided IC packaging design |
| title_short | Computer aided IC packaging design |
| title_sort | computer aided ic packaging design |
| topic | DRNTU::Engineering::Manufacturing::CAD/CAM systems |
| url | http://hdl.handle.net/10356/20525 |
| work_keys_str_mv | AT zahiruddinakm computeraidedicpackagingdesign |