Computer aided IC packaging design

Computer aided IC packaging design

In recent years knowledge based applications have gained access in many areas of engineering. This kind of approach is particularly appropriate, among others, in solving problems related to selection, classification, configuration, diagnosis, monitoring and planning.

Opis bibliograficzny
1. autor:	Zahiruddin A. K. M.
Kolejni autorzy:	Song, Bin
Format:	Praca dyplomowa
Język:	English
Wydane:	2009
Hasła przedmiotowe:	DRNTU::Engineering::Manufacturing::CAD/CAM systems
Dostęp online:	http://hdl.handle.net/10356/20525

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