Design of a new bonding machine
The purpose of this project is to design a new bonding machine to replace a five-year old machine. This bonding machine is used in semiconductor industry to do wire bonding that is a process using gold wire to connect bonding pads on die to leads. The design requirements of this new machine are to i...
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| Format: | Thesis |
| Language: | English |
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2009
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| Online Access: | http://hdl.handle.net/10356/20562 |
| _version_ | 1826123690925883392 |
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| author | Wong, Yam Mo. |
| author2 | Chang, James Yu Chung |
| author_facet | Chang, James Yu Chung Wong, Yam Mo. |
| author_sort | Wong, Yam Mo. |
| collection | NTU |
| description | The purpose of this project is to design a new bonding machine to replace a five-year old machine. This bonding machine is used in semiconductor industry to do wire bonding that is a process using gold wire to connect bonding pads on die to leads. The design requirements of this new machine are to increase throughput, improve machine stability, enhance process capability and provide simpler operation so as to maintain its competitiveness in the market. The concepts to achieve the design requirements are described in this report. |
| first_indexed | 2024-10-01T06:08:26Z |
| format | Thesis |
| id | ntu-10356/20562 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2024-10-01T06:08:26Z |
| publishDate | 2009 |
| record_format | dspace |
| spelling | ntu-10356/205622020-09-26T22:13:24Z Design of a new bonding machine Wong, Yam Mo. Chang, James Yu Chung Gintic Institute of Manufacturing Technology DRNTU::Engineering::Manufacturing::Product engineering The purpose of this project is to design a new bonding machine to replace a five-year old machine. This bonding machine is used in semiconductor industry to do wire bonding that is a process using gold wire to connect bonding pads on die to leads. The design requirements of this new machine are to increase throughput, improve machine stability, enhance process capability and provide simpler operation so as to maintain its competitiveness in the market. The concepts to achieve the design requirements are described in this report. Master of Science (Precision Engineering) 2009-12-15T03:22:46Z 2009-12-15T03:22:46Z 1996 1996 Thesis http://hdl.handle.net/10356/20562 en NANYANG TECHNOLOGICAL UNIVERSITY 62 p. application/pdf |
| spellingShingle | DRNTU::Engineering::Manufacturing::Product engineering Wong, Yam Mo. Design of a new bonding machine |
| title | Design of a new bonding machine |
| title_full | Design of a new bonding machine |
| title_fullStr | Design of a new bonding machine |
| title_full_unstemmed | Design of a new bonding machine |
| title_short | Design of a new bonding machine |
| title_sort | design of a new bonding machine |
| topic | DRNTU::Engineering::Manufacturing::Product engineering |
| url | http://hdl.handle.net/10356/20562 |
| work_keys_str_mv | AT wongyammo designofanewbondingmachine |