Design of a new bonding machine

The purpose of this project is to design a new bonding machine to replace a five-year old machine. This bonding machine is used in semiconductor industry to do wire bonding that is a process using gold wire to connect bonding pads on die to leads. The design requirements of this new machine are to i...

詳細記述

書誌詳細
第一著者: Wong, Yam Mo.
その他の著者: Chang, James Yu Chung
フォーマット: 学位論文
言語:English
出版事項: 2009
主題:
オンライン・アクセス:http://hdl.handle.net/10356/20562

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