Design of a new bonding machine
The purpose of this project is to design a new bonding machine to replace a five-year old machine. This bonding machine is used in semiconductor industry to do wire bonding that is a process using gold wire to connect bonding pads on die to leads. The design requirements of this new machine are to i...
第一著者: | Wong, Yam Mo. |
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その他の著者: | Chang, James Yu Chung |
フォーマット: | 学位論文 |
言語: | English |
出版事項: |
2009
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主題: | |
オンライン・アクセス: | http://hdl.handle.net/10356/20562 |
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