Design of a new bonding machine

Design of a new bonding machine

The purpose of this project is to design a new bonding machine to replace a five-year old machine. This bonding machine is used in semiconductor industry to do wire bonding that is a process using gold wire to connect bonding pads on die to leads. The design requirements of this new machine are to i...

書誌詳細
第一著者:	Wong, Yam Mo.
その他の著者:	Chang, James Yu Chung
フォーマット:	学位論文
言語:	English
出版事項:	2009
主題:	DRNTU::Engineering::Manufacturing::Product engineering
オンライン･アクセス:	http://hdl.handle.net/10356/20562

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