A Knowledge-based system for semiconductor wirebonding process and machine troubleshooting
Determining the root cause of machine/process failure plays a critical role in machine uptime and utilisation which directly impacts productivity. Rapid, accurate diagnosis is key to determining the root cause of failure. This Wirebonding Diagnostic Assistant (WBDA) is used to diagnose both process...
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Thesis |
| Language: | English |
| Published: |
2009
|
| Subjects: | |
| Online Access: | http://hdl.handle.net/10356/20564 |
| _version_ | 1826111094577430528 |
|---|---|
| author | Chung, Kok Wah. |
| author2 | Ho, Hiang Kwee |
| author_facet | Ho, Hiang Kwee Chung, Kok Wah. |
| author_sort | Chung, Kok Wah. |
| collection | NTU |
| description | Determining the root cause of machine/process failure plays a critical role in machine uptime and utilisation which directly impacts productivity. Rapid, accurate diagnosis is key to determining the root cause of failure. This Wirebonding Diagnostic Assistant (WBDA) is used to diagnose both process and machine related problems and also act as a training system for the wire bonding process. This WBDA is able to advise the technical support staff in the troubleshooting of six major thermosonic wirebonding process problems, namely golf ball, broken stitch, irregular wire loop, lifted stitch, cratering and non-sticking problems. It is also able to allow the user to enter the symptoms observed and find for possible/potential faults that are arising. |
| first_indexed | 2024-10-01T02:45:00Z |
| format | Thesis |
| id | ntu-10356/20564 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2024-10-01T02:45:00Z |
| publishDate | 2009 |
| record_format | dspace |
| spelling | ntu-10356/205642020-09-26T22:11:49Z A Knowledge-based system for semiconductor wirebonding process and machine troubleshooting Chung, Kok Wah. Ho, Hiang Kwee Gintic Institute of Manufacturing Technology DRNTU::Engineering::Manufacturing Determining the root cause of machine/process failure plays a critical role in machine uptime and utilisation which directly impacts productivity. Rapid, accurate diagnosis is key to determining the root cause of failure. This Wirebonding Diagnostic Assistant (WBDA) is used to diagnose both process and machine related problems and also act as a training system for the wire bonding process. This WBDA is able to advise the technical support staff in the troubleshooting of six major thermosonic wirebonding process problems, namely golf ball, broken stitch, irregular wire loop, lifted stitch, cratering and non-sticking problems. It is also able to allow the user to enter the symptoms observed and find for possible/potential faults that are arising. Master of Science (Computer Integrated Manufacturing) 2009-12-15T03:22:53Z 2009-12-15T03:22:53Z 1995 1995 Thesis http://hdl.handle.net/10356/20564 en NANYANG TECHNOLOGICAL UNIVERSITY 205 p. application/pdf |
| spellingShingle | DRNTU::Engineering::Manufacturing Chung, Kok Wah. A Knowledge-based system for semiconductor wirebonding process and machine troubleshooting |
| title | A Knowledge-based system for semiconductor wirebonding process and machine troubleshooting |
| title_full | A Knowledge-based system for semiconductor wirebonding process and machine troubleshooting |
| title_fullStr | A Knowledge-based system for semiconductor wirebonding process and machine troubleshooting |
| title_full_unstemmed | A Knowledge-based system for semiconductor wirebonding process and machine troubleshooting |
| title_short | A Knowledge-based system for semiconductor wirebonding process and machine troubleshooting |
| title_sort | knowledge based system for semiconductor wirebonding process and machine troubleshooting |
| topic | DRNTU::Engineering::Manufacturing |
| url | http://hdl.handle.net/10356/20564 |
| work_keys_str_mv | AT chungkokwah aknowledgebasedsystemforsemiconductorwirebondingprocessandmachinetroubleshooting AT chungkokwah knowledgebasedsystemforsemiconductorwirebondingprocessandmachinetroubleshooting |