Copper interconnect by filtered cathodic vacuum arc technique
This project discussed the copper interconnect by filtered cathodic vacuum arc technique.
| Main Authors: | , , |
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| Other Authors: | |
| Format: | Research Report |
| Published: |
2008
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| Subjects: | |
| Online Access: | http://hdl.handle.net/10356/2884 |
| _version_ | 1826128855718428672 |
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| author | Lau, Daniel Shu Ping Tay, Beng Kang Shi, Xu |
| author2 | School of Electrical and Electronic Engineering |
| author_facet | School of Electrical and Electronic Engineering Lau, Daniel Shu Ping Tay, Beng Kang Shi, Xu |
| author_sort | Lau, Daniel Shu Ping |
| collection | NTU |
| description | This project discussed the copper interconnect by filtered cathodic vacuum arc technique. |
| first_indexed | 2024-10-01T07:31:21Z |
| format | Research Report |
| id | ntu-10356/2884 |
| institution | Nanyang Technological University |
| last_indexed | 2024-10-01T07:31:21Z |
| publishDate | 2008 |
| record_format | dspace |
| spelling | ntu-10356/28842023-03-04T03:24:08Z Copper interconnect by filtered cathodic vacuum arc technique Lau, Daniel Shu Ping Tay, Beng Kang Shi, Xu School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging This project discussed the copper interconnect by filtered cathodic vacuum arc technique. RG 41/99 2008-09-17T09:16:16Z 2008-09-17T09:16:16Z 2003 2003 Research Report http://hdl.handle.net/10356/2884 Nanyang Technological University application/pdf |
| spellingShingle | DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging Lau, Daniel Shu Ping Tay, Beng Kang Shi, Xu Copper interconnect by filtered cathodic vacuum arc technique |
| title | Copper interconnect by filtered cathodic vacuum arc technique |
| title_full | Copper interconnect by filtered cathodic vacuum arc technique |
| title_fullStr | Copper interconnect by filtered cathodic vacuum arc technique |
| title_full_unstemmed | Copper interconnect by filtered cathodic vacuum arc technique |
| title_short | Copper interconnect by filtered cathodic vacuum arc technique |
| title_sort | copper interconnect by filtered cathodic vacuum arc technique |
| topic | DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging |
| url | http://hdl.handle.net/10356/2884 |
| work_keys_str_mv | AT laudanielshuping copperinterconnectbyfilteredcathodicvacuumarctechnique AT taybengkang copperinterconnectbyfilteredcathodicvacuumarctechnique AT shixu copperinterconnectbyfilteredcathodicvacuumarctechnique |