Optimization of tungsten chemical mechanical polishing process
In this project, the W-CMP process was improved by extending the polishing pad life by 3 times by evaluating on the 3M diamond conditioner as compared to the standard hard brush conditioner. Furthermore, the effect of Thomas West Inc TW711 hard pad on the reduction of large tungsten area Metal-Insul...
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| Format: | Thesis |
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2008
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| Online Access: | http://hdl.handle.net/10356/3342 |
| _version_ | 1811687273071116288 |
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| author | Tan, Eng Hoe. |
| author2 | Tse, Man Siu |
| author_facet | Tse, Man Siu Tan, Eng Hoe. |
| author_sort | Tan, Eng Hoe. |
| collection | NTU |
| description | In this project, the W-CMP process was improved by extending the polishing pad life by 3 times by evaluating on the 3M diamond conditioner as compared to the standard hard brush conditioner. Furthermore, the effect of Thomas West Inc TW711 hard pad on the reduction of large tungsten area Metal-Insulator-Metal (MIM) capacitor dishing and oxide erosion were investigated, and results obtained saw significantly as much as 60% and 38% less dishing and oxide erosion respectively as compared to Thomas West TW813 soft pad.. Lastly, the effect of diluted slurry of CABOT SSW2000 with water in 1:1 ratio at 2.5% H2O2 concentration was carried out, the process specifications was met and comparable product yield result as non-diluted slurry was observed. Indirectly a significant amount of cost saving and shorter tool down-time for consumables changes were also realized from these experiments. |
| first_indexed | 2024-10-01T05:13:41Z |
| format | Thesis |
| id | ntu-10356/3342 |
| institution | Nanyang Technological University |
| last_indexed | 2024-10-01T05:13:41Z |
| publishDate | 2008 |
| record_format | dspace |
| spelling | ntu-10356/33422023-07-04T15:44:43Z Optimization of tungsten chemical mechanical polishing process Tan, Eng Hoe. Tse, Man Siu School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Microelectronics In this project, the W-CMP process was improved by extending the polishing pad life by 3 times by evaluating on the 3M diamond conditioner as compared to the standard hard brush conditioner. Furthermore, the effect of Thomas West Inc TW711 hard pad on the reduction of large tungsten area Metal-Insulator-Metal (MIM) capacitor dishing and oxide erosion were investigated, and results obtained saw significantly as much as 60% and 38% less dishing and oxide erosion respectively as compared to Thomas West TW813 soft pad.. Lastly, the effect of diluted slurry of CABOT SSW2000 with water in 1:1 ratio at 2.5% H2O2 concentration was carried out, the process specifications was met and comparable product yield result as non-diluted slurry was observed. Indirectly a significant amount of cost saving and shorter tool down-time for consumables changes were also realized from these experiments. Master of Science (Microelectronics) 2008-09-17T09:27:52Z 2008-09-17T09:27:52Z 2003 2003 Thesis http://hdl.handle.net/10356/3342 Nanyang Technological University application/pdf |
| spellingShingle | DRNTU::Engineering::Electrical and electronic engineering::Microelectronics Tan, Eng Hoe. Optimization of tungsten chemical mechanical polishing process |
| title | Optimization of tungsten chemical mechanical polishing process |
| title_full | Optimization of tungsten chemical mechanical polishing process |
| title_fullStr | Optimization of tungsten chemical mechanical polishing process |
| title_full_unstemmed | Optimization of tungsten chemical mechanical polishing process |
| title_short | Optimization of tungsten chemical mechanical polishing process |
| title_sort | optimization of tungsten chemical mechanical polishing process |
| topic | DRNTU::Engineering::Electrical and electronic engineering::Microelectronics |
| url | http://hdl.handle.net/10356/3342 |
| work_keys_str_mv | AT tanenghoe optimizationoftungstenchemicalmechanicalpolishingprocess |