Effect of surface treatments on Cu/Ultra-low k interconnection technology
Single damascene copper interconnect structures were fabricated. Cu/ultra-low-k (porous SiLKTM) interconnects were subjected to surface treatments to study the effects on the structural and electrical properties, including Fourier transform infrared spectroscopy, atomic force microscopy and electr...
| Tác giả chính: | |
|---|---|
| Tác giả khác: | |
| Định dạng: | Luận văn |
| Được phát hành: |
2008
|
| Những chủ đề: | |
| Truy cập trực tuyến: | http://hdl.handle.net/10356/3363 |
| _version_ | 1826117797163302912 |
|---|---|
| author | Tan, Hwa Jin. |
| author2 | Lau, Wai Shing |
| author_facet | Lau, Wai Shing Tan, Hwa Jin. |
| author_sort | Tan, Hwa Jin. |
| collection | NTU |
| description | Single damascene copper interconnect structures were fabricated. Cu/ultra-low-k (porous SiLKTM) interconnects were subjected to surface treatments to study the effects on the structural and electrical properties, including Fourier transform infrared spectroscopy, atomic force microscopy and electrical testing. |
| first_indexed | 2024-10-01T04:33:13Z |
| format | Thesis |
| id | ntu-10356/3363 |
| institution | Nanyang Technological University |
| last_indexed | 2024-10-01T04:33:13Z |
| publishDate | 2008 |
| record_format | dspace |
| spelling | ntu-10356/33632023-07-04T16:15:20Z Effect of surface treatments on Cu/Ultra-low k interconnection technology Tan, Hwa Jin. Lau, Wai Shing School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Electronic apparatus and materials Single damascene copper interconnect structures were fabricated. Cu/ultra-low-k (porous SiLKTM) interconnects were subjected to surface treatments to study the effects on the structural and electrical properties, including Fourier transform infrared spectroscopy, atomic force microscopy and electrical testing. Master of Science (Microelectronics) 2008-09-17T09:28:20Z 2008-09-17T09:28:20Z 2004 2004 Thesis http://hdl.handle.net/10356/3363 Nanyang Technological University application/pdf |
| spellingShingle | DRNTU::Engineering::Electrical and electronic engineering::Electronic apparatus and materials Tan, Hwa Jin. Effect of surface treatments on Cu/Ultra-low k interconnection technology |
| title | Effect of surface treatments on Cu/Ultra-low k interconnection technology |
| title_full | Effect of surface treatments on Cu/Ultra-low k interconnection technology |
| title_fullStr | Effect of surface treatments on Cu/Ultra-low k interconnection technology |
| title_full_unstemmed | Effect of surface treatments on Cu/Ultra-low k interconnection technology |
| title_short | Effect of surface treatments on Cu/Ultra-low k interconnection technology |
| title_sort | effect of surface treatments on cu ultra low k interconnection technology |
| topic | DRNTU::Engineering::Electrical and electronic engineering::Electronic apparatus and materials |
| url | http://hdl.handle.net/10356/3363 |
| work_keys_str_mv | AT tanhwajin effectofsurfacetreatmentsoncuultralowkinterconnectiontechnology |