Investigation of via2 chain test structure high resistance failure

Investigation of via2 chain test structure high resistance failure

This report covers an investigation into the failure mechanism behind the via resistance failure in an electrical test structure. Intermittent high resistance failures occur in the via 2 chain test structure for a certain process. The failed wafers showed marginally high resistance at max 4 ohm/via...

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Bibliographic Details
Main Author:	Tan, Tze Han.
Other Authors:	School of Electrical and Electronic Engineering
Format:	Thesis
Published:	2008
Subjects:	DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
Online Access:	http://hdl.handle.net/10356/3397

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