A study on electromigration by driving force approach for submicron copper interconnect
The prime interest of this thesis work is to investigate the physics of electromigration failure in submicron Cu interconnections including the effect of surrounding materials. A combined driving force model, including the forces from the stress and temperature gradients is presented. Experiments ar...
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| Format: | Thesis |
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2008
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| Online Access: | https://hdl.handle.net/10356/3479 |