Failure mechanisms in HfO2 high-k gate stack MOSFETs

The failure mechanisms in HfO2 high-k/polycrystalline-silicon (poly-Si) and HfO2 high-k/TaN/TiN gate stack n/p-metal-oxide-semiconductor field effect transistors (MOSFETs) under inversion and accumulation mode constant voltage stress have been studied both electrically and physically with the aid...

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Main Author: Ranjan Rakesh
Other Authors: Pey Kin Leong
Format: Thesis
Published: 2008
Subjects:
Online Access:https://hdl.handle.net/10356/3538
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author Ranjan Rakesh
author2 Pey Kin Leong
author_facet Pey Kin Leong
Ranjan Rakesh
author_sort Ranjan Rakesh
collection NTU
description The failure mechanisms in HfO2 high-k/polycrystalline-silicon (poly-Si) and HfO2 high-k/TaN/TiN gate stack n/p-metal-oxide-semiconductor field effect transistors (MOSFETs) under inversion and accumulation mode constant voltage stress have been studied both electrically and physically with the aid of high resolution transmission electron microscopy (HRTEM), energy dispersive spectrometry (EDS) and electron energy loss spectrometry (EELS) and EELS elemental dot mapping. Silicon oxynitride (SiOxNy)/poly-Si, silicon nitride (Si3N4) semi-high-k/poly-Si gate stack MOSFETs have also been studied for comparison. The associated dielectric degradation has been correlated with the microstructural changes during breakdown event to understand the actual failure mechanisms. It is found that the breakdown phenomenon and the fundamental failure mechanisms responsible for breakdown in HfO2 high-k gate stacks are significantly different from that of SiOxNy and Si3N4 gate stack MOSFETs. Several new failure mechanisms/defects have been observed in HfO2 high-k/poly-Si and HfO2 high-k/TaN/TiN gate stack n/pMOSFETs.
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spelling ntu-10356/35382023-07-04T16:57:01Z Failure mechanisms in HfO2 high-k gate stack MOSFETs Ranjan Rakesh Pey Kin Leong School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Electronic circuits The failure mechanisms in HfO2 high-k/polycrystalline-silicon (poly-Si) and HfO2 high-k/TaN/TiN gate stack n/p-metal-oxide-semiconductor field effect transistors (MOSFETs) under inversion and accumulation mode constant voltage stress have been studied both electrically and physically with the aid of high resolution transmission electron microscopy (HRTEM), energy dispersive spectrometry (EDS) and electron energy loss spectrometry (EELS) and EELS elemental dot mapping. Silicon oxynitride (SiOxNy)/poly-Si, silicon nitride (Si3N4) semi-high-k/poly-Si gate stack MOSFETs have also been studied for comparison. The associated dielectric degradation has been correlated with the microstructural changes during breakdown event to understand the actual failure mechanisms. It is found that the breakdown phenomenon and the fundamental failure mechanisms responsible for breakdown in HfO2 high-k gate stacks are significantly different from that of SiOxNy and Si3N4 gate stack MOSFETs. Several new failure mechanisms/defects have been observed in HfO2 high-k/poly-Si and HfO2 high-k/TaN/TiN gate stack n/pMOSFETs. DOCTOR OF PHILOSOPHY (EEE) 2008-09-17T09:31:51Z 2008-09-17T09:31:51Z 2007 2007 Thesis https://hdl.handle.net/10356/3538 10.32657/10356/3538 Nanyang Technological University application/pdf
spellingShingle DRNTU::Engineering::Electrical and electronic engineering::Electronic circuits
Ranjan Rakesh
Failure mechanisms in HfO2 high-k gate stack MOSFETs
title Failure mechanisms in HfO2 high-k gate stack MOSFETs
title_full Failure mechanisms in HfO2 high-k gate stack MOSFETs
title_fullStr Failure mechanisms in HfO2 high-k gate stack MOSFETs
title_full_unstemmed Failure mechanisms in HfO2 high-k gate stack MOSFETs
title_short Failure mechanisms in HfO2 high-k gate stack MOSFETs
title_sort failure mechanisms in hfo2 high k gate stack mosfets
topic DRNTU::Engineering::Electrical and electronic engineering::Electronic circuits
url https://hdl.handle.net/10356/3538
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