Stress measurement in copper films
The aim is to study the behaviour of copper film stack deposited on silicon wafers as a function of temperature and time by monitoring the sample curvvature during a specified thermal history.
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| Other Authors: | |
| Format: | Thesis |
| Published: |
2008
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| Online Access: | http://hdl.handle.net/10356/3545 |
| _version_ | 1811688696346312704 |
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| author | Teo, Chee Hiang. |
| author2 | Prasad, Krishnamachar |
| author_facet | Prasad, Krishnamachar Teo, Chee Hiang. |
| author_sort | Teo, Chee Hiang. |
| collection | NTU |
| description | The aim is to study the behaviour of copper film stack deposited on silicon wafers as a function of temperature and time by monitoring the sample curvvature during a specified thermal history. |
| first_indexed | 2024-10-01T05:36:19Z |
| format | Thesis |
| id | ntu-10356/3545 |
| institution | Nanyang Technological University |
| last_indexed | 2024-10-01T05:36:19Z |
| publishDate | 2008 |
| record_format | dspace |
| spelling | ntu-10356/35452023-07-04T15:49:31Z Stress measurement in copper films Teo, Chee Hiang. Prasad, Krishnamachar School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Electronic apparatus and materials The aim is to study the behaviour of copper film stack deposited on silicon wafers as a function of temperature and time by monitoring the sample curvvature during a specified thermal history. Master of Science (Microelectronics) 2008-09-17T09:32:01Z 2008-09-17T09:32:01Z 2003 2003 Thesis http://hdl.handle.net/10356/3545 Nanyang Technological University application/pdf |
| spellingShingle | DRNTU::Engineering::Electrical and electronic engineering::Electronic apparatus and materials Teo, Chee Hiang. Stress measurement in copper films |
| title | Stress measurement in copper films |
| title_full | Stress measurement in copper films |
| title_fullStr | Stress measurement in copper films |
| title_full_unstemmed | Stress measurement in copper films |
| title_short | Stress measurement in copper films |
| title_sort | stress measurement in copper films |
| topic | DRNTU::Engineering::Electrical and electronic engineering::Electronic apparatus and materials |
| url | http://hdl.handle.net/10356/3545 |
| work_keys_str_mv | AT teocheehiang stressmeasurementincopperfilms |