Characterization of copper chemical mechanical polishing induced defects
Our results show that defects such as scratches and organic residues were produced by our Cu CMP process. Scratches can be attributed to the abrasive particles incorporated in the polishing slurry.
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| Other Authors: | |
| Format: | Thesis |
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2008
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| Online Access: | http://hdl.handle.net/10356/3564 |
| _version_ | 1824455181711966208 |
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| author | Teo, Tai Yong. |
| author2 | Goh, Wang Ling |
| author_facet | Goh, Wang Ling Teo, Tai Yong. |
| author_sort | Teo, Tai Yong. |
| collection | NTU |
| description | Our results show that defects such as scratches and organic residues were produced by our Cu CMP process. Scratches can be attributed to the abrasive particles incorporated in the polishing slurry. |
| first_indexed | 2025-02-19T03:34:08Z |
| format | Thesis |
| id | ntu-10356/3564 |
| institution | Nanyang Technological University |
| last_indexed | 2025-02-19T03:34:08Z |
| publishDate | 2008 |
| record_format | dspace |
| spelling | ntu-10356/35642023-07-04T15:49:43Z Characterization of copper chemical mechanical polishing induced defects Teo, Tai Yong. Goh, Wang Ling School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Electronic apparatus and materials Our results show that defects such as scratches and organic residues were produced by our Cu CMP process. Scratches can be attributed to the abrasive particles incorporated in the polishing slurry. Master of Engineering 2008-09-17T09:32:31Z 2008-09-17T09:32:31Z 2004 2004 Thesis http://hdl.handle.net/10356/3564 Nanyang Technological University application/pdf |
| spellingShingle | DRNTU::Engineering::Electrical and electronic engineering::Electronic apparatus and materials Teo, Tai Yong. Characterization of copper chemical mechanical polishing induced defects |
| title | Characterization of copper chemical mechanical polishing induced defects |
| title_full | Characterization of copper chemical mechanical polishing induced defects |
| title_fullStr | Characterization of copper chemical mechanical polishing induced defects |
| title_full_unstemmed | Characterization of copper chemical mechanical polishing induced defects |
| title_short | Characterization of copper chemical mechanical polishing induced defects |
| title_sort | characterization of copper chemical mechanical polishing induced defects |
| topic | DRNTU::Engineering::Electrical and electronic engineering::Electronic apparatus and materials |
| url | http://hdl.handle.net/10356/3564 |
| work_keys_str_mv | AT teotaiyong characterizationofcopperchemicalmechanicalpolishinginduceddefects |