A structured approach for routing of high density PCB
The aim of this project is to design a Structured Methodology for Routing of High Density Printed Circuit Board (PCB). PCB may include the through hole components and Surface Mounted Technology (SMT) components. The routing methodology is based on the Modularized Routing Methodology. This methodolog...
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| Format: | Thesis |
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2008
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| Online Access: | http://hdl.handle.net/10356/3579 |
| _version_ | 1826118982649774080 |
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| author | Thein Po. |
| author2 | Chua, Hong Chuek |
| author_facet | Chua, Hong Chuek Thein Po. |
| author_sort | Thein Po. |
| collection | NTU |
| description | The aim of this project is to design a Structured Methodology for Routing of High Density Printed Circuit Board (PCB). PCB may include the through hole components and Surface Mounted Technology (SMT) components. The routing methodology is based on the Modularized Routing Methodology. This methodology can guarantee 100% completion of auto routing and pre-determine the number of layer required. |
| first_indexed | 2024-10-01T04:52:30Z |
| format | Thesis |
| id | ntu-10356/3579 |
| institution | Nanyang Technological University |
| last_indexed | 2024-10-01T04:52:30Z |
| publishDate | 2008 |
| record_format | dspace |
| spelling | ntu-10356/35792023-07-04T15:17:35Z A structured approach for routing of high density PCB Thein Po. Chua, Hong Chuek School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Electronic circuits The aim of this project is to design a Structured Methodology for Routing of High Density Printed Circuit Board (PCB). PCB may include the through hole components and Surface Mounted Technology (SMT) components. The routing methodology is based on the Modularized Routing Methodology. This methodology can guarantee 100% completion of auto routing and pre-determine the number of layer required. Master of Science (Consumer Electronics) 2008-09-17T09:32:52Z 2008-09-17T09:32:52Z 2005 2005 Thesis http://hdl.handle.net/10356/3579 Nanyang Technological University application/pdf |
| spellingShingle | DRNTU::Engineering::Electrical and electronic engineering::Electronic circuits Thein Po. A structured approach for routing of high density PCB |
| title | A structured approach for routing of high density PCB |
| title_full | A structured approach for routing of high density PCB |
| title_fullStr | A structured approach for routing of high density PCB |
| title_full_unstemmed | A structured approach for routing of high density PCB |
| title_short | A structured approach for routing of high density PCB |
| title_sort | structured approach for routing of high density pcb |
| topic | DRNTU::Engineering::Electrical and electronic engineering::Electronic circuits |
| url | http://hdl.handle.net/10356/3579 |
| work_keys_str_mv | AT theinpo astructuredapproachforroutingofhighdensitypcb AT theinpo structuredapproachforroutingofhighdensitypcb |