Study and development of advanced packaging technique for semiconductor lasers
213 p.
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| Other Authors: | |
| Format: | Thesis |
| Published: |
2010
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| Online Access: | https://hdl.handle.net/10356/35957 |
| _version_ | 1826120304475242496 |
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| author | Teo, Ronnie Jin Wah |
| author2 | Shi Xunqing |
| author_facet | Shi Xunqing Teo, Ronnie Jin Wah |
| author_sort | Teo, Ronnie Jin Wah |
| collection | NTU |
| description | 213 p. |
| first_indexed | 2024-10-01T05:14:00Z |
| format | Thesis |
| id | ntu-10356/35957 |
| institution | Nanyang Technological University |
| last_indexed | 2024-10-01T05:14:00Z |
| publishDate | 2010 |
| record_format | dspace |
| spelling | ntu-10356/359572023-03-04T16:38:01Z Study and development of advanced packaging technique for semiconductor lasers Teo, Ronnie Jin Wah Shi Xunqing Wang Zhenfeng Yuan Shu Li Guoyuan Chen Zhong School of Materials Science & Engineering DRNTU::Engineering::Materials::Electronic packaging materials 213 p. The development of Erbium-Doped Fiber Amplifiers (EDFA) in long-haul telecommunications applications resulted in the rapid evolution of high power semiconductor lasers. In these applications, the demand for increased channel density in fiber-optic communication has pushed forward the use of single-mode ridge-waveguide laser diodes (LDs). DOCTOR OF PHILOSOPHY (MSE) 2010-04-23T02:14:54Z 2010-04-23T02:14:54Z 2007 2007 Thesis Teo, R. J. W. (2007). Study and development of advanced packaging technique for semiconductor lasers. Doctoral thesis, Nanyang Technological University, Singapore. https://hdl.handle.net/10356/35957 10.32657/10356/35957 application/pdf |
| spellingShingle | DRNTU::Engineering::Materials::Electronic packaging materials Teo, Ronnie Jin Wah Study and development of advanced packaging technique for semiconductor lasers |
| title | Study and development of advanced packaging technique for semiconductor lasers |
| title_full | Study and development of advanced packaging technique for semiconductor lasers |
| title_fullStr | Study and development of advanced packaging technique for semiconductor lasers |
| title_full_unstemmed | Study and development of advanced packaging technique for semiconductor lasers |
| title_short | Study and development of advanced packaging technique for semiconductor lasers |
| title_sort | study and development of advanced packaging technique for semiconductor lasers |
| topic | DRNTU::Engineering::Materials::Electronic packaging materials |
| url | https://hdl.handle.net/10356/35957 |
| work_keys_str_mv | AT teoronniejinwah studyanddevelopmentofadvancedpackagingtechniqueforsemiconductorlasers |