Reliability study on polymer/inorganic interface in microelectronic packaging
183 p.
| Main Author: | |
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| Other Authors: | |
| Format: | Thesis |
| Published: |
2010
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| Online Access: | https://hdl.handle.net/10356/36114 |
| _version_ | 1826111170502721536 |
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| author | Zhang, Yanlie |
| author2 | Zhou Wei |
| author_facet | Zhou Wei Zhang, Yanlie |
| author_sort | Zhang, Yanlie |
| collection | NTU |
| description | 183 p. |
| first_indexed | 2024-10-01T02:46:16Z |
| format | Thesis |
| id | ntu-10356/36114 |
| institution | Nanyang Technological University |
| last_indexed | 2024-10-01T02:46:16Z |
| publishDate | 2010 |
| record_format | dspace |
| spelling | ntu-10356/361142023-03-11T17:46:49Z Reliability study on polymer/inorganic interface in microelectronic packaging Zhang, Yanlie Zhou Wei School of Mechanical and Aerospace Engineering DRNTU::Engineering::Manufacturing::Polymers and plastics 183 p. Flip chip technology has been increasingly used in electronics packaging and considerable effort has been made in the recent years to increase the reliability of the solder joints. It has been well established that underfill can be introduced to improve lifetime of solder joints in flip chip structures. However, due to considerable coefficient of thermal expansion (CTE) mismatch between the underfill and its adjacent materials such as silicon wafer and FR-4 composite, delamination at the interface of the adjacent layers becomes a new reliability problem. The CTE mismatch and manufacturing defects between underfill and its adjacent materials may induce severe interfacial delamination during temperature variation or in the presence of moisture. The present project, therefore, aimed to study the delamination behaviour using either temperature cycling test or hygrothermal loading. DOCTOR OF PHILOSOPHY (MAE) 2010-04-23T02:28:51Z 2010-04-23T02:28:51Z 2006 2006 Thesis Zhang, Y. (2006). Reliability study on polymer/inorganic interface in microelectronic packaging. Doctoral thesis, Nanyang Technological University, Singapore. https://hdl.handle.net/10356/36114 10.32657/10356/36114 application/pdf |
| spellingShingle | DRNTU::Engineering::Manufacturing::Polymers and plastics Zhang, Yanlie Reliability study on polymer/inorganic interface in microelectronic packaging |
| title | Reliability study on polymer/inorganic interface in microelectronic packaging |
| title_full | Reliability study on polymer/inorganic interface in microelectronic packaging |
| title_fullStr | Reliability study on polymer/inorganic interface in microelectronic packaging |
| title_full_unstemmed | Reliability study on polymer/inorganic interface in microelectronic packaging |
| title_short | Reliability study on polymer/inorganic interface in microelectronic packaging |
| title_sort | reliability study on polymer inorganic interface in microelectronic packaging |
| topic | DRNTU::Engineering::Manufacturing::Polymers and plastics |
| url | https://hdl.handle.net/10356/36114 |
| work_keys_str_mv | AT zhangyanlie reliabilitystudyonpolymerinorganicinterfaceinmicroelectronicpackaging |