The temperature distribution and thermal stresses induced during processing of partial SOI structures
In this work, the numerical results on the distribution of thermal stress at the interface of partial SOI structures are presented.
| 主要作者: | |
|---|---|
| 其他作者: | |
| 格式: | Thesis |
| 出版: |
2008
|
| 主題: | |
| 在線閱讀: | http://hdl.handle.net/10356/3771 |
| _version_ | 1826125641097936896 |
|---|---|
| author | Chen, Junming. |
| author2 | Tan, Cher Ming |
| author_facet | Tan, Cher Ming Chen, Junming. |
| author_sort | Chen, Junming. |
| collection | NTU |
| description | In this work, the numerical results on the distribution of thermal stress at the interface of partial SOI structures are presented. |
| first_indexed | 2024-10-01T06:39:58Z |
| format | Thesis |
| id | ntu-10356/3771 |
| institution | Nanyang Technological University |
| last_indexed | 2024-10-01T06:39:58Z |
| publishDate | 2008 |
| record_format | dspace |
| spelling | ntu-10356/37712023-07-04T16:24:01Z The temperature distribution and thermal stresses induced during processing of partial SOI structures Chen, Junming. Tan, Cher Ming School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Semiconductors In this work, the numerical results on the distribution of thermal stress at the interface of partial SOI structures are presented. Master of Engineering 2008-09-17T09:37:10Z 2008-09-17T09:37:10Z 2002 2002 Thesis http://hdl.handle.net/10356/3771 Nanyang Technological University application/pdf |
| spellingShingle | DRNTU::Engineering::Electrical and electronic engineering::Semiconductors Chen, Junming. The temperature distribution and thermal stresses induced during processing of partial SOI structures |
| title | The temperature distribution and thermal stresses induced during processing of partial SOI structures |
| title_full | The temperature distribution and thermal stresses induced during processing of partial SOI structures |
| title_fullStr | The temperature distribution and thermal stresses induced during processing of partial SOI structures |
| title_full_unstemmed | The temperature distribution and thermal stresses induced during processing of partial SOI structures |
| title_short | The temperature distribution and thermal stresses induced during processing of partial SOI structures |
| title_sort | temperature distribution and thermal stresses induced during processing of partial soi structures |
| topic | DRNTU::Engineering::Electrical and electronic engineering::Semiconductors |
| url | http://hdl.handle.net/10356/3771 |
| work_keys_str_mv | AT chenjunming thetemperaturedistributionandthermalstressesinducedduringprocessingofpartialsoistructures AT chenjunming temperaturedistributionandthermalstressesinducedduringprocessingofpartialsoistructures |