The temperature distribution and thermal stresses induced during processing of partial SOI structures

In this work, the numerical results on the distribution of thermal stress at the interface of partial SOI structures are presented.

Bibliographic Details
Main Author: Chen, Junming.
Other Authors: Tan, Cher Ming
Format: Thesis
Published: 2008
Subjects:
Online Access:http://hdl.handle.net/10356/3771
_version_ 1826125641097936896
author Chen, Junming.
author2 Tan, Cher Ming
author_facet Tan, Cher Ming
Chen, Junming.
author_sort Chen, Junming.
collection NTU
description In this work, the numerical results on the distribution of thermal stress at the interface of partial SOI structures are presented.
first_indexed 2024-10-01T06:39:58Z
format Thesis
id ntu-10356/3771
institution Nanyang Technological University
last_indexed 2024-10-01T06:39:58Z
publishDate 2008
record_format dspace
spelling ntu-10356/37712023-07-04T16:24:01Z The temperature distribution and thermal stresses induced during processing of partial SOI structures Chen, Junming. Tan, Cher Ming School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Semiconductors In this work, the numerical results on the distribution of thermal stress at the interface of partial SOI structures are presented. Master of Engineering 2008-09-17T09:37:10Z 2008-09-17T09:37:10Z 2002 2002 Thesis http://hdl.handle.net/10356/3771 Nanyang Technological University application/pdf
spellingShingle DRNTU::Engineering::Electrical and electronic engineering::Semiconductors
Chen, Junming.
The temperature distribution and thermal stresses induced during processing of partial SOI structures
title The temperature distribution and thermal stresses induced during processing of partial SOI structures
title_full The temperature distribution and thermal stresses induced during processing of partial SOI structures
title_fullStr The temperature distribution and thermal stresses induced during processing of partial SOI structures
title_full_unstemmed The temperature distribution and thermal stresses induced during processing of partial SOI structures
title_short The temperature distribution and thermal stresses induced during processing of partial SOI structures
title_sort temperature distribution and thermal stresses induced during processing of partial soi structures
topic DRNTU::Engineering::Electrical and electronic engineering::Semiconductors
url http://hdl.handle.net/10356/3771
work_keys_str_mv AT chenjunming thetemperaturedistributionandthermalstressesinducedduringprocessingofpartialsoistructures
AT chenjunming temperaturedistributionandthermalstressesinducedduringprocessingofpartialsoistructures